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74LV27PW-T

Description
NOR Gate, CMOS, PDSO14,
Categorylogic    logic   
File Size359KB,8 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Download Datasheet Parametric Compare View All

74LV27PW-T Overview

NOR Gate, CMOS, PDSO14,

74LV27PW-T Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP14,.25
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G14
JESD-609 codee0
Load capacitance (CL)50 pF
Logic integrated circuit typeNOR GATE
MaximumI(ol)0.016 A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
power supply3.3 V
Prop。Delay @ Nom-Sup16 ns
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Base Number Matches1

74LV27PW-T Related Products

74LV27PW-T 74LV27DB-T
Description NOR Gate, CMOS, PDSO14, NOR Gate, CMOS, PDSO14,
Is it Rohs certified? incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSSOP, TSSOP14,.25 SSOP, SSOP14,.3
Reach Compliance Code unknown unknown
JESD-30 code R-PDSO-G14 R-PDSO-G14
JESD-609 code e0 e0
Load capacitance (CL) 50 pF 50 pF
Logic integrated circuit type NOR GATE NOR GATE
MaximumI(ol) 0.016 A 0.016 A
Number of terminals 14 14
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP
Encapsulate equivalent code TSSOP14,.25 SSOP14,.3
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL
power supply 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 16 ns 16 ns
Certification status Not Qualified Not Qualified
Schmitt trigger NO NO
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm
Terminal location DUAL DUAL
Base Number Matches 1 1

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