Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Datasheet
Filter
B69812N2457A301
Features
•
SMD filter consisting of coupled resonators with stepped impedances
•
extreme low losses
•
high attenuations at GSM (900, 1800, 1900) bands
•
stable performance over wide temperature range
•
excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
Component drawing
Recommended footprint
Page 3
Characteristics
Maximum ratings
Typical passband characteristic
Page 4
Processing information
Soldering requirements
Delivery mode
ISSUE DATE
19.08.03
ISSUE
A
PUBLISHER
SAW MWC PD F
PAGE
1/4
Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Datasheet
Component drawing
Filter
B69812N2457A301
View from below onto the solder terminals and view from beside
Recommended footprint
Top view and marking
soldered areas
I/O Pads must be terminated with
50
Ω
characteristic impedance
ISSUE DATE
19.08.03
ISSUE
A
PUBLISHER
SAW MWC PD F
PAGE
2/4
Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Datasheet
Characteristics over whole temperature range
min.
typ.
Filter
B69812N2457A301
max.
Center frequency
Insertion loss (2400 – 2483MHz)
Passband
Amplitude ripple (peak - peak)
Standing wave ratio
Impedance (2400 – 2483MHz)
Attenuation
at DC to 960 MHz
at 960 to 1990 MHz
at 2100 to 2170 MHz
Maximum ratings
f
c -
2.4415
0.8
-
1.2
GHz
dB
MHz
α
IL
B
83
∆α
SWR
Z
0.4
1.5
50
42
32
20
46
35
23
0.8
2.0
dB
Ω
dB
dB
dB
α
IEC climatic category (IEC 68-1)
Operating temperature
Typical passband characteristic
0
- 40/+ 90/56
T
op - 40 / + 85
°C
-10
-20
[dB]
S11 [dB]
S21 [dB]
-30
-40
-50
-60
1,8
1,9
2,0
2,1
2,2
2,3
2,4
2,5
2,6
2,7
Frequency [GHz]
ISSUE DATE
19.08.03
ISSUE
A
PUBLISHER
SAW MWC PD F
2,8
PAGE
3/4
Microwave Ceramics and Modules
2-Pole Filter for W-LAN
Datasheet
Processing information
Filter
B69812N2457A301
ZNr.: 527 (FILT95_2)
Wettability to IEC 68-2-58:
≥
75% (after aging)
Soldering requirements
Profile for eutectic
SnPb solder paste
Soldering type
reflow
Maximum soldering temperature
235 (max. 2 sec.)
(measuring point on top surface of the component) 225 (max. 10 sec.)
Recommended soldering conditions (infrared):
Temp. [°C]
within 10 sec.
Profile for leadfree
solder paste
reflow
260 (max. 2 sec.) °C
250 (max. 10 sec.) °C
Temp. [°C]
within 10 sec.
245°C±5°C
215°C±10°C
20-40 sec.
40-80 sec.
Time [sec.]
30 sec.
2.5 °C/s
2-3 min.
Time [sec.]
> - 5 °C/s
eutectic SnPb solder paste profile
Delivery mode
leadfree solder paste profile
Blister tape acc. to IEC 286-3, polystyrol, grey
Pieces/tape: 3000
Profile B-B:
Reel: diamerter - 330mm
Profile A-A:
8▒0.1
A
1.9▒0.1
12▒0.3
B
5.5▒0.05
2▒0.05
4▒0.1
A
10x4(=40▒0.2)
B
1.75▒0.1
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto
and the information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed
characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the
Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers'
Association), unless otherwise agreed.
ISSUE DATE
19.08.03
ISSUE
A
PUBLISHER
SAW MWC PD F
PAGE
4/4
京公网安备 11010802033920号
EEWORLD
