P89C51RD+IN datasheet, PDF - EEWORLD Datasheet

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P89C51RD+IN: DescriptionMicrocontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40,; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，46 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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P89C51RD+IN Overview

Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40,

P89C51RD+IN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DIP, DIP40,.6
Reach Compliance Code	unknown
bit size	8
CPU series	8051
JESD-30 code	R-PDIP-T40
JESD-609 code	e0
Number of terminals	40
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP40,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	1024
rom(word)	65536
ROM programmability	FLASH
speed	33 MHz
Maximum slew rate	49.7 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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P89C51RD+IN Related Products

	P89C51RD+IN	P89C51RD+IB	P89C51RD+JA	P89C51RC+IN
Description	Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PQFP44,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PQCC44,	Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP40,.6	QFP, QFP44,.5SQ,32	QCCJ, LDCC44,.7SQ	DIP, DIP40,.6
Reach Compliance Code	unknown	unknown	unknown	unknown
bit size	8	8	8	8
CPU series	8051	8051	8051	8051
JESD-30 code	R-PDIP-T40	S-PQFP-G44	S-PQCC-J44	R-PDIP-T40
JESD-609 code	e0	e0	e0	e0
Number of terminals	40	44	44	40
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QFP	QCCJ	DIP
Encapsulate equivalent code	DIP40,.6	QFP44,.5SQ,32	LDCC44,.7SQ	DIP40,.6
Package shape	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR
Package form	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	1024	1024	1024	512
rom(word)	65536	65536	65536	32768
ROM programmability	FLASH	FLASH	FLASH	FLASH
speed	33 MHz	33 MHz	33 MHz	33 MHz
Maximum slew rate	49.7 mA	49.7 mA	49.7 mA	49.7 mA
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	0.8 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1

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