24 I/O, PIA-GENERAL PURPOSE, CDIP40
| Parameter Name | Attribute value |
| Maker | Intel |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 40 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| JESD-30 code | R-PDIP-T40 |
| length | 52.26 mm |
| Number of I/O lines | 24 |
| Number of ports | 3 |
| Number of terminals | 40 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| surface mount | NO |
| technology | CMOS |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE |
| 8255A-5 | P8255A | P8255A-5 | 8255A | D8255A | D8255A-5 | |
|---|---|---|---|---|---|---|
| Description | 24 I/O, PIA-GENERAL PURPOSE, CDIP40 | 24 I/O, PIA-GENERAL PURPOSE, CDIP40 | 24 I/O, PIA-GENERAL PURPOSE, CDIP40 | 24 I/O, PIA-GENERAL PURPOSE, CDIP40 | 24 I/O, PIA-GENERAL PURPOSE, CDIP40 | PROGRAMMABLE PERIPHEAL INTERFACE |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-hole | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | pair | DUAL | DUAL |
| Maker | Intel | Intel | Intel | - | Intel | Intel |
| Parts packaging code | DIP | DIP | DIP | - | DIP | - |
| package instruction | DIP, | DIP-40 | DIP, DIP40,.6 | - | DIP, DIP40,.6 | - |
| Contacts | 40 | 40 | 40 | - | 40 | - |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | - | EAR99 | - |
| JESD-30 code | R-PDIP-T40 | R-PDIP-T40 | R-PDIP-T40 | - | R-XDIP-T40 | R-XDIP-T40 |
| Number of I/O lines | 24 | 24 | 24 | - | 24 | - |
| Number of ports | 3 | 3 | 3 | 3 | 3 | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED | CERAMIC |
| encapsulated code | DIP | DIP | DIP | - | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | - | NO | NO |
| technology | CMOS | MOS | NMOS | - | CMOS | MOS |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| uPs/uCs/peripheral integrated circuit type | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | - | PARALLEL IO PORT, GENERAL PURPOSE | - |
| Is it Rohs certified? | - | incompatible | incompatible | - | incompatible | incompatible |
| JESD-609 code | - | e0 | e0 | - | e0 | e0 |
| Maximum operating temperature | - | 70 °C | 70 °C | - | 70 °C | 70 °C |
| Encapsulate equivalent code | - | DIP40,.6 | DIP40,.6 | - | DIP40,.6 | DIP40,.6 |
| power supply | - | 5 V | 5 V | - | 5 V | 5 V |
| Maximum slew rate | - | 120 mA | 120 mA | - | 120 mA | 120 mA |
| Nominal supply voltage | - | 5 V | 5 V | - | 5 V | 5 V |
| Temperature level | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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