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82C37

Description
MULTIMODE DMA CONTROLLER
File Size2MB,65 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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82C37 Overview

MULTIMODE DMA CONTROLLER

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Description MULTIMODE DMA CONTROLLER MULTIMODE DMA CONTROLLER MULTIMODE DMA CONTROLLER MULTIMODE DMA CONTROLLER MULTIMODE DMA CONTROLLER
Is it Rohs certified? - incompatible incompatible incompatible -
Maker - Toshiba Semiconductor Toshiba Semiconductor Toshiba Semiconductor -
Parts packaging code - LCC SSOP DIP -
package instruction - QCCJ, LDCC44,.7SQ SSOP, SOP40,.5,30 DIP, DIP40,.6 -
Contacts - 44 40 40 -
Reach Compliance Code - unknow unknow unknow -
Other features - SINGLE/BLOCK/DEMAND XFR MODES; FIXED & ROTATIONAL PRI INTRPT MODES; DATA XFR RATE [MBYTES/SEC.] = 5 SINGLE/BLOCK/DEMAND XFR MODES; FIXED & ROTATIONAL PRI INTRPT MODES; DATA XFR RATE [MBYTES/SEC.] = 5 SINGLE/BLOCK/DEMAND XFR MODES; FIXED & ROTATIONAL PRI INTRPT MODES; DATA XFR RATE [MBYTES/SEC.] = 5 -
Address bus width - 16 16 16 -
Bus compatibility - 8085 8085 8085 -
maximum clock frequency - 5 MHz 5 MHz 5 MHz -
External data bus width - 8 8 8 -
JESD-30 code - S-PQCC-J44 R-PDSO-G40 R-PDIP-T40 -
JESD-609 code - e0 e0 e0 -
length - 16.5862 mm 17.5 mm 50.7 mm -
Number of DMA channels - 4 4 4 -
Number of terminals - 44 40 40 -
Maximum operating temperature - 85 °C 85 °C 85 °C -
Minimum operating temperature - -40 °C -40 °C -40 °C -
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code - QCCJ SSOP DIP -
Encapsulate equivalent code - LDCC44,.7SQ SOP40,.5,30 DIP40,.6 -
Package shape - SQUARE RECTANGULAR RECTANGULAR -
Package form - CHIP CARRIER SMALL OUTLINE, SHRINK PITCH IN-LINE -
power supply - 5 V 5 V 5 V -
Certification status - Not Qualified Not Qualified Not Qualified -
Maximum seat height - 4.52 mm 2.8 mm 4.8 mm -
Maximum slew rate - 10 mA 10 mA 10 mA -
Maximum supply voltage - 5.5 V 5.5 V 5.5 V -
Minimum supply voltage - 4.5 V 4.5 V 4.5 V -
Nominal supply voltage - 5 V 5 V 5 V -
surface mount - YES YES NO -
technology - CMOS CMOS CMOS -
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form - J BEND GULL WING THROUGH-HOLE -
Terminal pitch - 1.27 mm 0.8 mm 2.54 mm -
Terminal location - QUAD DUAL DUAL -
width - 16.5862 mm 8.8 mm 15.24 mm -
uPs/uCs/peripheral integrated circuit type - DMA CONTROLLER DMA CONTROLLER DMA CONTROLLER -
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