LSI53C1000 datasheet, PDF - EEWORLD Datasheet

LSI53C1000: DescriptionSCSI Bus Controller, CMOS, PBGA329, 31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，384 Pages; ManufacturerBroadcom

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LSI53C1000 Overview

SCSI Bus Controller, CMOS, PBGA329, 31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329

Parameter Name	Attribute value
package instruction	BGA, BGA329,23X23,50
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Address bus width	64
Bus compatibility	PCI
maximum clock frequency	160 MHz
Maximum data transfer rate	160 MBps
External data bus width	64
JESD-30 code	S-PBGA-B329
JESD-609 code	e0
length	31 mm
Number of terminals	329
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA329,23X23,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.52 mm
Maximum slew rate	800 mA
Maximum supply voltage	3.47 V
Minimum supply voltage	3.13 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	31 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, SCSI
Base Number Matches	1

TECHNICAL

MANUAL

LSI53C1000

PCI to Ultra160

SCSI Controller

July 2003

Version 2.2

DB14-000128-04

	LSI53C1000
Description	SCSI Bus Controller, CMOS, PBGA329, 31 X 31 MM, 1.27 MM PITCH, PLASTIC, BGA-329
package instruction	BGA, BGA329,23X23,50
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Address bus width	64
Bus compatibility	PCI
maximum clock frequency	160 MHz
Maximum data transfer rate	160 MBps
External data bus width	64
JESD-30 code	S-PBGA-B329
JESD-609 code	e0
length	31 mm
Number of terminals	329
Maximum operating temperature	70 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA329,23X23,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	2.52 mm
Maximum slew rate	800 mA
Maximum supply voltage	3.47 V
Minimum supply voltage	3.13 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	31 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, SCSI
Base Number Matches	1

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

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