The LC0408FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In ad-
dition, the LC0408FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low
inductance virtually eliminates overshoot voltage due to package inductance.
FeatuRes
•
•
•
•
•
•
•
•
•
•
•
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
200 Watts Peak Pulse Power per Line (tp = 8/20µs)
Protection for 4 to 7 Lines
Bidirectional and Monolithic Structure
Low Clamping Voltage
Low Capacitance
RoHS Compliant
REACH Compliant
aPPLiCations
•
•
•
•
•
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
MeChaniCaL ChaRaCteRistiCs
•
•
•
•
•
•
•
•
Standard EIA Chip Size: 0408
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
Pin ConFiGuRation
05153.R9 9/12
Page 1
www.protekdevices.com
05153
Only One Name Means ProTek’Tion™
LC0408FC3.3C - LC0408FC36C
tyPiCaL DeviCe ChaRaCteRistiCs
MaXiMuM RatinGs
@ 25°C unless otherwise specified
PaRaMeteR
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
syMBoL
P
PP
T
A
T
STG
vaLue
200
-55 to 150
-55 to 150
units
Watts
°C
°C
eLeCtRiCaL ChaRaCteRistiCs PeR Line
@ 25°C unless otherwise specified
PaRt
nuMBeR
(note 1)
RateD
stanD-oFF
voLtaGe
v
wM
voLts
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
LC0408FC36C
notes
3.3
5.9
8.0
12.0
15.0
24.0
36.0
MiniMuM
BReaKDown
voLtaGe
@ 1ma
v
(BR)
voLts
4.0
6.0
8.5
13.3
16.7
26.7
40.0
MaXiMuM
CLaMPinG
voLtaGe
(Fig. 2)
@ i
P
= 1a
v
C
voLts
7.0
11.0
13.2
19.8
25.4
37.2
70.0
MaXiMuM
CLaMPinG
voLtaGe
(Fig. 2)
@ 8/20µs
v
C
@ i
PP
12.5V @ 16A
13.0 @ 15A
18.0V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
MaXiMuM
LeaKaGe
CuRRent
(note 2)
@v
wM
i
D
µa
75*
10**
1
1
1
1
1
tyPiCaL
CaPaCitanCe
@0v, 1Mhz
C
pF
70
35
32
30
25
20
18
1. All devices are bidirectional. Electrical characteristics apply in both directions.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V.
05153.R9 9/12
Page 2
www.protekdevices.com
05153
Only One Name Means ProTek’Tion™
LC0408FC3.3C - LC0408FC36C
tyPiCaL DeviCe ChaRaCteRistiCs
FiGuRe 1
PeaK PuLse PoweR vs PuLse tiMe
10,000
P
PP
- Peak Pulse Power - watts
1,000
200W, 8/20µs Waveform
100
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
120
i
PP
- Peak Pulse Current - % of i
PP
FiGuRe 2
PuLse wave FoRM
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
100
80
% of Rated Power
FiGuRe 3
PoweR DeRatinG CuRve
Peak Pulse Power
8/20µs
100
80
60
40
20
0
0
5
e
-t
60
40
20
0
Average Power
t
d
= t/(I
PP
/2)
10
15
t - time - µs
20
25
30
0
25
50
75 100 125
t
a
- ambient temperature - °C
150
05153.R9 9/12
Page 3
www.protekdevices.com
05153
Only One Name Means ProTek’Tion™
LC0408FC3.3C - LC0408FC36C
tyPiCaL DeviCe ChaRaCteRistiCs
FiGuRe 4
oveRshoot & CLaMPinG voLtaGe FoR LC0408FC05C
35
25
5 volts per Division
15
5
-5
esD test Pulse - 25 kilovolt, 1/30ns (waveshape)
FiGuRe 5
tyPiCaL CLaMPinG voLtaGe vs PeaK PuLse CuRRent LC0408FC05C
The voltage stabilizer introduced in this article is inexpensive and has easy-to-buy components, which is suitable for radio enthusiasts to make their own. [b]Circuit principle[/b]: The circuit princi...
I will graduate in one year. Please give me some advice. I want to enter the field of embedded development. I learned a lot in college, including LINUX operating system, brew, assembly, C, C++, JAVA, ...
[i=s] This post was last edited by wjunlin on 2018-10-9 10:19 [/i] Test environment Room temperature, adjustable power supply, load DC small motor 1. Control end test, connect different voltage no-loa...
There are many kinds of software for PCB design. For a beginner, considering future development, which design software should I choose? It would be best if the experts could explain the differences be...
Application of SCADA system of PLC and MDS wireless data transmission radio in water plant This paper introduces the composition and function of wireless water supply dispatching system with S7-200 PL...
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
Capable of providing precise and efficient thermal management for artificial intelligence computing power, intelligent sensing and autonomous driving systems
Shenzhen, ...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]
Compiled from semiengineering
The industry is increasingly concerned about power consumption in AI, but there are no simple solutions. This requires a deep understanding of software and ...[Details]
On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]
Silicon Labs (also known as "Silicon Labs"), an innovative leader in low-power wireless connectivity, will showcase its cutting-edge artificial intelligence (AI) and Internet of Things (IoT) solu...[Details]
Today, the voltage of electronic products continues to rise to 400V, 600V and even 1000V, so there are few electronic load models that can handle such high voltages. Many people consider connecting...[Details]
With rapid economic development, the types of pollution sources are increasing, especially in chemical and industrial zones and their surroundings. The patterns of pollution and the types of ecolog...[Details]
Which is better, copper braided wire flexible connector or copper stranded wire flexible connector? When choosing copper wire flexible connector, people always struggle with whether to use copper b...[Details]
The assisted driving industry in 2025 stands at the dual crossroads of "large-scale implementation" and "safety upgrades." Cities like Beijing and Wuhan have already issued regulations de...[Details]
The term "remote meter reading" literally emphasizes remoteness. But how far is remote? One kilometer? Two kilometers? Those aren't considered far at all. Currently, the longest distance for ...[Details]
Lisle, Illinois – August 19, 2025 –
Molex Incorporated, a global electronics giant and leader in connected innovation, celebrates the opening of its new China sales office dedicated to the auto...[Details]
Chip architecture licensing company ARM has hired Amazon's AI chip chief Rami Sinno to help advance its plan to develop its own complete chip, people familiar with the matter said, according to Reu...[Details]
DIY/Open Source Hardware
京公网安备 11010802033920号
EEWORLD
