EEWORLDEEWORLDEEWORLD

Part Number

Search

250B18W471KV4E

Description
LOW INDUCTANCE CHIP CAPACITORS
File Size54KB,2 Pages
ManufacturerETC
Download Datasheet View All

250B18W471KV4E Overview

LOW INDUCTANCE CHIP CAPACITORS

L
OW
I
NDUCTANCE
C
HIP
C
APACITORS
These MLC capacitors are specially designed to lower
inductance by altering the aspect ratio of the termination
in conjunction with improved conductivity of the electrodes.
This inherent low ESL and ESR design improves the
capacitor circuit performance by lowering the current
change noise pulse and voltage drop. The system will
benefit by lower power consumption, increased efficiency,
and higher operating speeds.
F
EATURES
• Low ESL
• High Resonant Frequency
• Low ESR
• Small Size
A
PPLICATIONS
• High Speed Microprocessors
• AC Noise Reduction in multi-chip modules (MCM)
• High speed digital equipment
B15 / 0508
Inches
L
W
T
E/B
.050 ±.010
.080 ±.010
.050 Max.
.010 ±.005
(mm)
(1.27 ±.25)
(2.03 ±.25)
(1.27)
(0.25±.13)
50 V
25 V
NPO
DIELECTRIC
16 V
50 V
25 V
16 V
B18 / 0612
Inches
L
W
T
E/B
.062 ±.010
.125 ±.010
.060 Max.
.010 ±.005
(mm)
(1.57 ±.25)
(3.17 ±.25)
(1.52)
(0.25±.13)
Dielectric specifications are listed on page 28 & 29.
H
OW TO
O
RDER
L
OW
I
NDUCTANCE
500
VOLTAGE
160 = 16 V
250 = 25 V
500 = 50 V
B18
CASE SIZE
B15 = 0508
B18 = 0612
W
DIELECTRIC
N = NPO
W = X7R
Z = Z5U
P/N written: 500B18W473KV4E
24
150
pF
180
pF
220
pF
330
pF
470
pF
100
0p
F
120
0p
F
220
0p
F
330
0p
F
470
0p
F
.01
F
.01
F
.02
F
.03
F
.04
F
0.1
F
0.1
F
0.2
F
0.3
F
0.4
F
1.0
F
X7R
Z5U
C
APACITANCE
S
ELECTION
473
CAPACITANCE
1st two digits are
significant; third digit
denotes number of
zeros.
474 = 0.47 µF
105 = 1.00 µF
J
K
M
Z
K
TOLERANCE
= ± 5%
= ± 10%
= ± 20%
= +80% -20%
V
TERMINATION
V = Nickel Barrier
MARKING
4 = Unmarked
4
E
TAPE MODIFIER
Code Type Reel
E
Plastic 7"
U
Plastic 13"
T
Paper 7"
R
Paper 13"
Tape specs. per EIA RS481
www.johanson dielectrics.com
Long-distance system block diagram_draft
I always feel like something is missing, but since this is my first time drawing this, I don't know exactly what is wrong. Could you please give me some pointers?...
lonerzf ADI Reference Circuit
Ask about the design of handshake communication protocol
I am designing a distributed production monitoring system, which uses a wireless transmission channel (GPRS) for data transmission, a data center (host computer), and 20-100 monitoring points for data...
maiwenjian Embedded System
PCB wiring design requirements that are easy to say but not difficult to do
The basic design process of general PCB is as follows: preliminary preparation -> PCB structure design -> PCB layout -> wiring -> wiring optimization and silk screen -> network and DRC inspection and ...
qwqwqw2088 PCB Design
ucGUI touch screen data input problem
I would like to ask, when I use the touch screen to input and modify data, should I use the ucGUI controls, or are there other better methods?...
xiaoqzq Real-time operating system RTOS
[MM32 eMiniBoard Evaluation] Environment Construction
Received the board on October 27, and spent 3 days getting familiar with it, including downloading the chip manual, MM32-LINK, and library files, etc. Finally, today, October 30th, it was done and the...
fxyc87 Domestic Chip Exchange
Radio remote control modules, components and applications
Books on radio remote control modules, components and applications can be used as a collection of materials...
xtss RF/Wirelessly

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2023  1496  2840  1040  684  41  31  58  21  14 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号