IC,DRAM,FAST PAGE,1MX1,CMOS,DIP,18PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | not_compliant |
| Maximum access time | 150 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-PDIP-T18 |
| memory density | 1048576 bit |
| Memory IC Type | FAST PAGE DRAM |
| memory width | 1 |
| Number of terminals | 18 |
| word count | 1048576 words |
| character code | 1000000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1MX1 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| Maximum standby current | 0.003 A |
| Maximum slew rate | 0.055 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| TMS4C1024-15N | TMS4C1024-15DJ | |
|---|---|---|
| Description | IC,DRAM,FAST PAGE,1MX1,CMOS,DIP,18PIN,PLASTIC | IC,DRAM,FAST PAGE,1MX1,CMOS,SOJ,20PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible |
| package instruction | DIP, DIP18,.3 | SOJ, SOJ20/26,.34 |
| Reach Compliance Code | not_compliant | not_compliant |
| Maximum access time | 150 ns | 150 ns |
| I/O type | SEPARATE | SEPARATE |
| JESD-30 code | R-PDIP-T18 | R-PDSO-J20 |
| memory density | 1048576 bit | 1048576 bit |
| Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM |
| memory width | 1 | 1 |
| Number of terminals | 18 | 20 |
| word count | 1048576 words | 1048576 words |
| character code | 1000000 | 1000000 |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 1MX1 | 1MX1 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOJ |
| Encapsulate equivalent code | DIP18,.3 | SOJ20/26,.34 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 |
| Maximum standby current | 0.003 A | 0.003 A |
| Maximum slew rate | 0.055 mA | 0.055 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |