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K7N161801M-EC16

Description
ZBT SRAM, 1MX18, 3.5ns, CMOS, PBGA119
Categorystorage    storage   
File Size350KB,20 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

K7N161801M-EC16 Overview

ZBT SRAM, 1MX18, 3.5ns, CMOS, PBGA119

K7N161801M-EC16 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionBGA, BGA119,7X17,50
Reach Compliance Codecompliant
Maximum access time3.5 ns
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B119
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width18
Number of terminals119
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX18
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA119,7X17,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum standby current0.03 A
Minimum standby current3.14 V
Maximum slew rate0.42 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Base Number Matches1
K7N163601M
K7N161801M
Document Title
512Kx36 & 1Mx18 Pipelined NtRAM
TM
512Kx36 & 1Mx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
History
1. Initial document.
1. Update ICC & ISB values.
1. Change I
SB
value from 80mA to 110mA at -67.
2. Change I
SB
value from 70mA to 90mA at -72 .
3. Change I
SB
value from 60mA to 80mA at -10 .
1. Change pin allocation at 119BGA .
- A4 ; from NC to A .
- B2 ; from A to CS2
- B4 ; from CKE to ADV
- B6 ; from A to CS2
- G4 ; from ADV to A
- H4 ; from NC to WE
- M4 ; from WE toCKE
2. Changed DC condition at Icc and parameters
Icc ; from 420mA to 400mA at -67,
from 370mA to 380mA at -75,
from 300mA to 320mA at -10,
1. Add tCYC 167MHz.
1. Final Spec Release.
1. Remove 100MHz
Draft Date
Dec. 22 . 1998
May. 27. 1999
Sep. 04. 1999
Remark
Preliminary
Preliminary
Preliminary
0.3
Nov. 19. 1999
Preliminary
0.4
1.0
2.0
Nov. 26. 1999
Dec. 08. 1999
Feb. 23. 2001
Preliminary
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
February 2001
Rev 2.0

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