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K7N801845M-TC100

Description
ZBT SRAM, 512KX18, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100
Categorystorage    storage   
File Size398KB,18 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K7N801845M-TC100 Overview

ZBT SRAM, 512KX18, 5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100

K7N801845M-TC100 Parametric

Parameter NameAttribute value
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
length20 mm
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
Base Number Matches1
K7N803645M
K7N801845M
Document Title
256Kx36 & 512Kx18 Pipelined NtRAM
TM
256Kx36 & 512Kx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
History
1. Initial document.
1. Changed speed bin from 167MHz to 150MHz
2. Changed DC Parameters;
I
CC
: from 400mA to 450mA , ISB : from 60mA to 20mA
I
SB2
: from 50mA to 85mA
1. Changed speed bin from 150MHz to 167MHz
2. Changed Power from 3.3V to 2.5V
3. Changed N.C pins to Power and ZZ Pin #14, #16, #64, #66
4. Changed some control pin names.
from CEN to CKE, from BWEx to BWx
5. Modify absolute maximum ratings
V
DD
; from 4.0V to 3.6V, V
IN
; from 4.6V to 3.6V
6. Changed DC parameters
I
SB
; from 20mA to 80mA, I
SB2
; from 85mA to 10mA
V
OL
; from 0.4V to 0.2V, V
OH
; from 2.4V to 2.0V
V
IL
; from 0.8V to 0.7V, V
IH
; from 2.0V to 1.7V
7. A
DD
the sleep mode timing and characteristics
CKE controlled timing and CS controlled timing
1. Removed speed bin 167MHz
2.Changed AC parameters
t
HZOE
; from 4.0 to 3.5 , t
HZC
;from 4.0 to 3.5 at -75
t
HZOE
; from 5.0 to 3.5 , t
HZC
;from 5.0 to 3.5 , t
CL/H
; 4.0 to 3.0 at -10
3.Modify Sleep Mode Waveform.
Changed Sleep Mode Electrical Characteristics .
t
PDS
;from Max 2cycle to Min 2cycle
t
PUS
; from Max 2cycle to Min 2cycle
1.Modify from ADV to ADV at timing.
2.A
DD
the Trade Mark( NtRAM
TM
)
1. Changed DC parameters
I
SB1
; from 10mA to 20mA, I
SB2
; from 10mA to 20mA
1. Changed t
CD
,t
OE
from 4.0ns to 4.2ns at -75.
1. Changed DC condition at Icc and parameters
I
CC
; from 420mA to 320mA at -67 , from 370mA to 300mA at -75
from 300mA to 250mA at -10.
I
SB
; from 70mA to 60mA at -67 , from 60mA to 50mA at -75
from 50mA to 40mA at -10.
1.Changed V
OL
Max value from 0.2V to 0.4V .
1. Add 119BGA(7x17 Ball Grid Array Package) .
1. Final spec release
1. Add t
CYC
167Mhz.
Draft Date
September. 1997
November. 1997
Remark
Preliminary
Preliminary
0.2
March. 11. 1998
Preliminary
0.3
April. 11. 1998
Preliminary
0.4
June. 02. 1998
Preliminary
0.5
Aug. 19. 1998
Preliminary
0.6
0.7
Sep. 28. 1998
Nov. 10. 1998
Preliminary
Preliminary
0.8
0.9
1.0
2.0
Dec. 23. 1998
Mar. 03. 1999
April. 01. 1999
Oct. 30. 1999
Preliminary
Preliminary
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
November 1999
Rev 3.0

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