Standard SRAM, 256KX8, 100ns, CMOS, PDSO32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| package instruction | TSSOP, TSSOP32,.8,20 |
| Reach Compliance Code | unknown |
| Maximum access time | 100 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| memory density | 2097152 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP32,.8,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2.3/3.3 V |
| Certification status | Not Qualified |
| reverse pinout | YES |
| Maximum standby current | 0.000001 A |
| Minimum standby current | 1 V |
| Maximum slew rate | 0.035 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| Base Number Matches | 1 |
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