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RMQCBA3636DGBA-182#AC0

Description
RMQCBA3636DGBA-182#AC0
Categorystorage    storage   
File Size360KB,30 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

RMQCBA3636DGBA-182#AC0 Overview

RMQCBA3636DGBA-182#AC0

RMQCBA3636DGBA-182#AC0 Parametric

Parameter NameAttribute value
Brand NameRenesas
Parts packaging codeLBGA
package instructionLBGA,
Contacts165
Manufacturer packaging codePLBG0165FE-A165
Reach Compliance Codecompliant
Maximum access time0.45 ns
JESD-30 codeR-PBGA-B165
length15 mm
memory density37748736 bit
Memory IC TypeDDR SRAM
memory width36
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm
Base Number Matches1
Datasheet
RMQCBA3636DGBA, RMQCBA3618DGBA
36-Mbit DDR™ II+ SRAM 2-word Burst
Architecture (2.5 Cycle Read latency)
Description
The RMQCBA3636DGBA is a 1,048,576-word by 36-bit and the RMQCBA3618DGBA is a 2,097,152-word by 18-bit
synchronous quad data rate static RAM fabricated with advanced CMOS technology using full CMOS six-transistor
memory cell. It integrates unique synchronous peripheral circuitry and a burst counter. All input registers are
controlled by an input clock pair (K and /K) and are latched on the positive edge of K and /K. These products are
suitable for applications which require synchronous operation, high speed, low voltage, high density and wide bit
configuration. These products are packaged in 165-pin plastic FBGA package.
R10DS0244EJ0100
Rev. 1.00
Jul. 15, 2015
Features
Power Supply
1.8 V for core (V
DD
), 1.4 V to V
DD
for I/O (V
DDQ
)
Clock
Fast clock cycle time for high bandwidth
Two input clocks (K and /K) for precise DDR timing at clock rising edges only
Two output echo clocks (CQ and /CQ) simplify data capture in high-speed systems
Clock-stop capability with
µs
restart
I/O
Common data input/output bus
Pipelined double data rate operation
HSTL I/O
User programmable output impedance
PLL circuitry for wide output data valid window and future frequency scaling
Data valid pin (QVLD) to indicate valid data on the output
Function
Two-tick burst for low DDR transaction size
Internally self-timed write control
Simple control logic for easy depth expansion
JTAG 1149.1 compatible test access port
Package
165 FBGA package (13 x 15 x 1.4 mm)
R10DS0244EJ0100 Rev. 1.00
Jul. 15, 2015
Page 1 of 29

RMQCBA3636DGBA-182#AC0 Related Products

RMQCBA3636DGBA-182#AC0 RMQCBA3618DGBA-182#AC0
Description RMQCBA3636DGBA-182#AC0 RMQCBA3618DGBA-182#AC0
Brand Name Renesas Renesas
Parts packaging code LBGA LBGA
package instruction LBGA, LBGA,
Contacts 165 165
Manufacturer packaging code PLBG0165FE-A165 PLBG0165FE-A165
Reach Compliance Code compliant compliant
Maximum access time 0.45 ns 0.45 ns
JESD-30 code R-PBGA-B165 R-PBGA-B165
length 15 mm 15 mm
memory density 37748736 bit 37748736 bit
Memory IC Type DDR SRAM DDR SRAM
memory width 36 18
Number of functions 1 1
Number of terminals 165 165
word count 1048576 words 2097152 words
character code 1000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 1MX36 2MX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Maximum seat height 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
width 13 mm 13 mm
Base Number Matches 1 1
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