IC,MEMORY CONTROLLER,ALS-TTL,LDCC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | QCCJ, LDCC(UNSPEC) |
| Reach Compliance Code | unknown |
| JESD-609 code | e0 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC(UNSPEC) |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 240 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| DP8419V | DP8419D | DP8419D-MSP | DP8419N | DP8419N/A+ | |
|---|---|---|---|---|---|
| Description | IC,MEMORY CONTROLLER,ALS-TTL,LDCC | IC,MEMORY CONTROLLER,ALS-TTL,DIP,48PIN | IC,MEMORY CONTROLLER,ALS-TTL,DIP,48PIN | IC,MEMORY CONTROLLER,ALS-TTL,DIP,48PIN | IC,MEMORY CONTROLLER,ALS-TTL,DIP,48PIN |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCJ, LDCC(UNSPEC) | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | LDCC(UNSPEC) | DIP48,.6 | DIP48,.6 | DIP48,.6 | DIP48,.6 |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum slew rate | 240 mA | 240 mA | 240 mA | 240 mA | 240 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| JESD-30 code | - | R-XDIP-T48 | R-XDIP-T48 | R-PDIP-T48 | R-PDIP-T48 |
| Number of terminals | - | 48 | 48 | 48 | 48 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
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