IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Reach Compliance Code | compliant |
| JESD-30 code | S-PQCC-J84 |
| JESD-609 code | e0 |
| Number of terminals | 84 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC84,1.2SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum slew rate | 260 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| DP8440V | DP8441VLJ | |
|---|---|---|
| Description | IC,MEMORY CONTROLLER,CMOS,LDCC,84PIN | IC,MEMORY CONTROLLER,CMOS,QFP,100PIN |
| Is it Rohs certified? | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant |
| JESD-30 code | S-PQCC-J84 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 84 | 100 |
| Maximum operating temperature | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QFP |
| Encapsulate equivalent code | LDCC84,1.2SQ | QFP100,.7X.9 |
| Package shape | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | FLATPACK |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum slew rate | 260 mA | 260 mA |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 0.635 mm |
| Terminal location | QUAD | QUAD |
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