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DM74LS189J/A+

Description
IC,SRAM,16X4,LS-TTL,DIP,16PIN,CERAMIC
Categorystorage    storage   
File Size201KB,3 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

DM74LS189J/A+ Overview

IC,SRAM,16X4,LS-TTL,DIP,16PIN,CERAMIC

DM74LS189J/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Memory IC TypeSTANDARD SRAM
memory width4
Number of terminals16
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16X4
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

DM74LS189J/A+ Related Products

DM74LS189J/A+
Description IC,SRAM,16X4,LS-TTL,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible
package instruction DIP, DIP16,.3
Reach Compliance Code unknown
JESD-30 code R-XDIP-T16
JESD-609 code e0
Memory IC Type STANDARD SRAM
memory width 4
Number of terminals 16
word count 16 words
character code 16
Operating mode ASYNCHRONOUS
Maximum operating temperature 70 °C
organize 16X4
Output characteristics 3-STATE
Package body material CERAMIC
encapsulated code DIP
Encapsulate equivalent code DIP16,.3
Package shape RECTANGULAR
Package form IN-LINE
Parallel/Serial PARALLEL
surface mount NO
technology TTL
Temperature level COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE
Terminal pitch 2.54 mm
Terminal location DUAL
Base Number Matches 1
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