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DM74LS366J/A+

Description
IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,CERAMIC
Categorylogic    logic   
File Size184KB,3 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

DM74LS366J/A+ Overview

IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,CERAMIC

DM74LS366J/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
Control typeENABLE LOW
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.016 A
Number of digits6
Number of functions1
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristics3-STATE
Output polarityINVERTED
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Maximum supply current (ICC)26 mA
Prop。Delay @ Nom-Sup17 ns
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

DM74LS366J/A+ Related Products

DM74LS366J/A+ DM74LS366AN/A+ DM74LS366N/A+
Description IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,CERAMIC IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,PLASTIC IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown
Control type ENABLE LOW ENABLE LOW ENABLE LOW
JESD-30 code R-XDIP-T16 R-PDIP-T16 R-PDIP-T16
JESD-609 code e0 e0 e0
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.016 A 0.024 A 0.016 A
Number of digits 6 6 6
Number of functions 1 1 1
Number of terminals 16 16 16
Maximum operating temperature 70 °C 70 °C 70 °C
Output characteristics 3-STATE 3-STATE 3-STATE
Output polarity INVERTED INVERTED INVERTED
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
power supply 5 V 5 V 5 V
Maximum supply current (ICC) 26 mA 21 mA 26 mA
Prop。Delay @ Nom-Sup 17 ns 25 ns 17 ns
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
Base Number Matches 1 1 1
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