SRAM Module, 256KX32, 30ns, CMOS, CPGA66, STACK, CERAMIC, PGA-66
| Parameter Name | Attribute value |
| Parts packaging code | PGA |
| package instruction | APGA, |
| Contacts | 66 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 30 ns |
| Spare memory width | 16 |
| JESD-30 code | R-CPGA-P66 |
| memory density | 8388608 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 66 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX32 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | APGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, PIGGYBACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 10.16 mm |
| Minimum standby current | 2 V |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Base Number Matches | 1 |
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