DPS512X32V3-70C datasheet, PDF

DPS512X32V3-70C: DescriptionSRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66; Categorystorage storage; File Size237KB，6 Pages; ManufacturerTwilight Technology Inc.

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DPS512X32V3-70C Overview

SRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	PGA, PGA66,11X11
Contacts	66
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	70 ns
Other features	CONFIGURABLE AS 512K X 32 OR 1M X 16
I/O type	COMMON
JESD-30 code	S-CPGA-P66
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA66,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	19.7104 mm
Maximum standby current	0.00072 A
Minimum standby current	2 V
Maximum slew rate	0.32 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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