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DPS512X32V3-70C

Description
SRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size237KB,6 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPS512X32V3-70C Overview

SRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS512X32V3-70C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codePGA
package instructionPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time70 ns
Other featuresCONFIGURABLE AS 512K X 32 OR 1M X 16
I/O typeCOMMON
JESD-30 codeS-CPGA-P66
JESD-609 codee0
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of ports1
Number of terminals66
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Maximum seat height19.7104 mm
Maximum standby current0.00072 A
Minimum standby current2 V
Maximum slew rate0.32 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
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