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MH4S64BKG-8

Description
Synchronous DRAM Module, 4MX64, 6ns, CMOS, DIMM-144
Categorystorage    storage   
File Size4MB,53 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

MH4S64BKG-8 Overview

Synchronous DRAM Module, 4MX64, 6ns, CMOS, DIMM-144

MH4S64BKG-8 Parametric

Parameter NameAttribute value
Parts packaging codeDIMM
package instructionDIMM, DIMM144,32
Contacts144
Reach Compliance Codeunknown
ECCN codeEAR99
access modeDUAL BANK PAGE BURST
Maximum access time6 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N144
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals144
word count4194304 words
character code4000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM144,32
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle4096
Maximum seat height25.4 mm
self refreshYES
Maximum standby current0.004 A
Maximum slew rate0.6 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch0.8 mm
Terminal locationDUAL
Base Number Matches1

MH4S64BKG-8 Related Products

MH4S64BKG-8 MH4S64BKG-7
Description Synchronous DRAM Module, 4MX64, 6ns, CMOS, DIMM-144 Synchronous DRAM Module, 4MX64, 6ns, CMOS, DIMM-144
Parts packaging code DIMM DIMM
package instruction DIMM, DIMM144,32 DIMM, DIMM144,32
Contacts 144 144
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
access mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Maximum access time 6 ns 6 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH
Maximum clock frequency (fCLK) 100 MHz 100 MHz
I/O type COMMON COMMON
JESD-30 code R-XDMA-N144 R-XDMA-N144
memory density 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64
Number of functions 1 1
Number of ports 1 1
Number of terminals 144 144
word count 4194304 words 4194304 words
character code 4000000 4000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 4MX64 4MX64
Output characteristics 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM
Encapsulate equivalent code DIMM144,32 DIMM144,32
Package shape RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V
Certification status Not Qualified Not Qualified
refresh cycle 4096 4096
Maximum seat height 25.4 mm 25.4 mm
self refresh YES YES
Maximum standby current 0.004 A 0.004 A
Maximum slew rate 0.6 mA 0.6 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD
Terminal pitch 0.8 mm 0.8 mm
Terminal location DUAL DUAL
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