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W19B320ABT9M

Description
Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48
Categorystorage    storage   
File Size479KB,53 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
Download Datasheet Parametric View All

W19B320ABT9M Overview

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48

W19B320ABT9M Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeTSOP
package instruction12 X 20 MM, LEAD FREE, TSOP-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time70 ns
Spare memory width8
startup blockBOTTOM
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length18.4 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
typeNOR TYPE
width12 mm
Base Number Matches1
W19B320AT/B Data Sheet
4M
×
8/2M
×
16 BITS
3V FLEXIBLE BANK FLASH MEMORY
Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATIONS ............................................................................................................ 5
BLOCK DIAGRAM ...................................................................................................................... 6
PIN DESCRIPTION..................................................................................................................... 6
FUNCTIONAL DESCRIPTION ................................................................................................... 7
6.1
Device Bus Operation..................................................................................................... 7
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
Word/Byte Configuration ..................................................................................................7
Reading Array Data ..........................................................................................................7
Writing Commands/Command Sequences.......................................................................7
Simultaneous Read/Write Operations with Zero Latency .................................................8
Standby Mode ..................................................................................................................8
Automatic Sleep Mode .....................................................................................................8
#RESET: Hardware Reset Pin..........................................................................................9
Output Disable Mode........................................................................................................9
Autoselect Mode...............................................................................................................9
Sector/Sector Block Protection and Unprotection...........................................................9
Write Protect (#WP) .....................................................................................................10
Temporary Sector Unprotect ........................................................................................10
Security Sector Flash Memory Region .........................................................................10
Hardware Data Protection ............................................................................................11
Reading Array Data ........................................................................................................12
Reset Command.............................................................................................................12
AUTOSELECT Command Sequence .............................................................................13
Byte/Word Program Command Sequence......................................................................13
Unlock Bypass Command Sequence .............................................................................14
Chip Erase Command Sequence ...................................................................................14
Sector Erase Command Sequence ................................................................................14
Erase Suspend/Erase Resume Commands ...................................................................15
DQ7: #Data Polling.........................................................................................................16
RY/#BY: Ready/#Busy ...................................................................................................16
DQ6: Toggle Bit I............................................................................................................16
6.2
Command Definitions ................................................................................................... 12
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.3
Write Operation Status ................................................................................................. 16
6.3.1
6.3.2
6.3.3
-1-
Publication Release Date: December 27, 2005
Revision A4

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