MT16LSDT464AG-663 datasheet, PDF

MT16LSDT464AG-663: DescriptionSynchronous DRAM Module, 4MX64, 9ns, CMOS, PDMA168; Categorystorage storage; File Size1MB，19 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT16LSDT464AG-663 Overview

Synchronous DRAM Module, 4MX64, 9ns, CMOS, PDMA168

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Reach Compliance Code	not_compliant
Maximum access time	9 ns
Maximum clock frequency (fCLK)	83 MHz
I/O type	COMMON
JESD-30 code	R-PDMA-N168
memory density	268435456 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	64
Number of terminals	168
word count	4194304 words
character code	4000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX64
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	29.21 mm
Maximum standby current	0.032 A
Maximum slew rate	1 mA
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

	MT16LSDT464AG-663	MT16LSDT464AG-10A
Description	Synchronous DRAM Module, 4MX64, 9ns, CMOS, PDMA168	Synchronous DRAM Module, 4MX64, 6ns, CMOS, PDMA168
Is it Rohs certified?	incompatible	incompatible
Reach Compliance Code	not_compliant	not_compliant
Maximum access time	9 ns	6 ns
Maximum clock frequency (fCLK)	83 MHz	125 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-PDMA-N168	R-PDMA-N168
memory density	268435456 bit	268435456 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	64	64
Number of terminals	168	168
word count	4194304 words	4194304 words
character code	4000000	4000000
Maximum operating temperature	70 °C	70 °C
organize	4MX64	4MX64
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
Maximum seat height	29.21 mm	29.21 mm
Maximum standby current	0.032 A	0.048 A
Maximum slew rate	1 mA	1.2 mA
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL
Base Number Matches	1	1

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