F214 (Rev 06MAR14)
BSE–020–01–F–D–A
BTE–040–02–L–D–A
BTE–060–02–F–D–A
(0,80 mm) .0315"
BTE, BSE SERIES
BASIC BLADE & BEAM HEADER & SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTE or
www.samtec.com?BSE
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
2 A per pin
(1 pin powered per row)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC with
5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
BTE
Mates with:
BSE
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
PLATING
OPTION
D
A
OTHER
OPTION
–K
–F
= Gold Flash on contact,
Matte Tin on tail
= (7,00 mm)
.275" DIA
Polyimide
Film Pick
& Place Pad
–020, –040, –060,
–080, –100, –120
No. of positions x (0,80) .0315
+ (4,00) .1575
01
–L
A
(4,27)
.168
(7,21)
.284
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
–TR
= Tape & Reel
(60 positions
maximum)
–01
(5,97)
.235
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on
Signal Pins in contact area,
Matte Tin over 50µ" (1,27 µm) min
Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
Processing:
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-080)
(0,15 mm) .006" max (100-120)
Board Stacking:
For applications requiring more
than two connectors per board
or 80 positions or higher,
contact ipg@samtec.com
(3,94)
.155
02
–02
(0,80) .0315
(7,11)
.280
(0,76)
.030
(0,89)
.035
DIA
A
(0,20)
.008
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
• Passes
10 year MFG
MATED HEIGHT
LEAD
STYLE
MATED
HEIGHT*
(5,00) .197
(8,00) .315
BSE
Mates with:
BTE
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
–01
–02
*Processing conditions will
affect mated height.
–F
–020, –040, –060,
–080, –100, –120
= Gold Flash on contact,
Matte Tin on tail
–TR
= Tape & Reel
(80 positions
maximum)
ALSO AVAILABLE
(MOQ Required)
30µ" (0,76 µm) Gold
Edge Mount Capability
Friction Lock option
11 mm, 14 mm, 16,10 mm,
19,10 mm, 22 mm,
25 mm and 30 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
Contact Samtec.
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
–L
= 10µ" (0,25 µm) Gold on contact,
Matte Tin on tail
•
•
•
•
–C*
No. of positions x (0,80) .0315
+ (5,27) .2075
02
(6,22)
.245
01
(3,81) (7,24)
.150 .285
(0,80) .0315
(3,25)
.128
(1,78)
.070
= Electro-Polished Selective
50µ" (1,27 µm) min Au over
150µ" (3,81 µm) Ni on Signal Pins in
contact area, Matte Tin over
50µ" (1,27 µm) min Ni on all solder tails
*Note:
–C Plating passes 10 year MFG testing
(7,49)
.295
(0,76)
.030
(0,89)
.035
DIA
(3,05)
.120
(0,15)
.006
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