IC,DSP,16-BIT,CMOS,QFP,100PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | QFP |
| package instruction | QFP, QFP100,.63SQ,20 |
| Contacts | 100 |
| Reach Compliance Code | not_compliant |
| bit size | 16 |
| Format | FIXED POINT |
| JESD-30 code | S-PQFP-G100 |
| Number of terminals | 100 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP100,.63SQ,20 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| RAM (number of words) | 2592 |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| TMS320LC2406PZ | TMS320LF2406PZ | TMS320LC2402PG | TMS320LC2404PZ | TMS320LF2407PGE | |
|---|---|---|---|---|---|
| Description | IC,DSP,16-BIT,CMOS,QFP,100PIN,PLASTIC | IC,DSP,16-BIT,CMOS,QFP,100PIN,PLASTIC | IC,DSP,16-BIT,CMOS,QFP,64PIN,PLASTIC | IC,DSP,16-BIT,CMOS,QFP,100PIN,PLASTIC | IC IC,DSP,16-BIT,CMOS,QFP,144PIN,PLASTIC, Digital Signal Processor |
| Parts packaging code | QFP | QFP | QFP | QFP | QFP |
| package instruction | QFP, QFP100,.63SQ,20 | QFP, QFP100,.63SQ,20 | QFP, QFP64,.7X.95,40 | QFP, QFP100,.63SQ,20 | QFP, QFP144,.87SQ,20 |
| Contacts | 100 | 100 | 64 | 100 | 144 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | not_compliant | unknown |
| bit size | 16 | 16 | 16 | 16 | 16 |
| Format | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| JESD-30 code | S-PQFP-G100 | S-PQFP-G100 | R-PQFP-G64 | S-PQFP-G100 | S-PQFP-G144 |
| Number of terminals | 100 | 100 | 64 | 100 | 144 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP | QFP | QFP | QFP |
| Encapsulate equivalent code | QFP100,.63SQ,20 | QFP100,.63SQ,20 | QFP64,.7X.95,40 | QFP100,.63SQ,20 | QFP144,.87SQ,20 |
| Package shape | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (number of words) | 2592 | 2592 | 2592 | 2592 | 2592 |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 1 mm | 0.5 mm | 0.5 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| Maker | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
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