IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| Control type | ENABLE LOW |
| JESD-30 code | R-XDIP-T20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.006 A |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MM54HCT244J/883 | MM54HCT240J/883 | MM54HCT240E/883 | MM74HCT244J/A+ | MM54HCT244J | MM54HCT244J/883C | MM54HCT244J/883B | MM74HCT244WM/A+ | MM74HCT244N/A+ | MM74HCT244N/B+ | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,LLCC,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | HCT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20, CERDIP-20 | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,CERAMIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,SOP,20PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,PLASTIC | IC,BUFFER/DRIVER,DUAL,4-BIT,HCT-CMOS,DIP,20PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-XDIP-T20 | R-XDIP-T20 | S-XQCC-N20 | R-XDIP-T20 | R-GDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| Number of digits | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | INVERTED | INVERTED | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | QCCN | DIP | DIP | DIP | DIP | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO | NO | NO | YES | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |