HLMT-PH00-NN024 datasheet, PDF

Datasheet> All Categories > LED optoelectronic/LED> photoelectric> HLMT-PH00-NN024

HLMT-PH00-NN024: DescriptionSingle Color LED, Reddish Orange, Untinted Nondiffused, 1.525mm, PLASTIC PACKAGE-2; CategoryLED optoelectronic/LED photoelectric; File Size71KB，9 Pages; ManufacturerBroadcom

Download Datasheet Parametric View All

HLMT-PH00-NN024 Overview

Single Color LED, Reddish Orange, Untinted Nondiffused, 1.525mm, PLASTIC PACKAGE-2

HLMT-PH00-NN024 Parametric

Parameter Name	Attribute value
Maker	Broadcom
package instruction	PLASTIC PACKAGE-2
Reach Compliance Code	compliant
color	REDDISH ORANGE
Configuration	SINGLE
Maximum forward current	0.05 A
Lens type	UNTINTED NONDIFFUSED
Nominal luminous intensity	37.5 mcd
Installation features	SURFACE MOUNT
Number of functions	1
Number of terminals	2
Maximum operating temperature	100 °C
Minimum operating temperature	-40 °C
Optoelectronic device types	SINGLE COLOR LED
total height	2.16 mm
method of packing	TAPE AND REEL 13"
peak wavelength	615 nm
shape	ROUND
size	1.525 mm
surface mount	YES
perspective	125 deg
Base Number Matches	1

Preview

Download Datasheet

View All

HLMA-Qx00, HLMA-Px00 HLMT-Px00 and HLMT-Qx00

Subminiature High Performance AlInGaP LED Lamps

Data Sheet

SunPower Series

HLMA-PF00, HLMA-PG00, HLMA-PH00, HLMA-PL00, HLMA-QF00, HLMA-QG00, HLMA-QH00,

HLMA-QL00, HLMT-PG00, HLMT-PH00, HLMT-PL00, HLMT-QG00, HLMT-QH00, HLMT-QL00

Description

Flat Top Package

The HLMX-PXXX flat top lamps use an untinted, nondif-

fused, truncated lens to provide a wide radiation pattern

that is necessary for use in backlighting applications. The

flat top lamps are also ideal for use as emitters in light

pipe applications.

Features



Subminiature flat top package

Ideal for backlighting and light piping applications



Subminiature dome package

Nondiffused dome for high brightness



Wide range of drive currents



Colors: 590 nm Amber, 605 nm Orange, 615 nm Red-

dish-Orange, 622/626 nm Red, and 635 nm Red



Ideal for space limited applications



Axial leads



Available with lead configurations for surface mount

and through hole PC board mounting

Dome Packages

The HLMX-QXXX dome lamps use an untinted, nondif-

fused lens to provide a high luminous intensity within a

narrow radiation pattern.

Lead Configurations

All of these devices are made by encapsulating LED chips

on axial lead frames to form molded epoxy submini-

ature lamp packages. A variety of package configuration

options is available. These include special surface mount

lead configurations, gull wing, yoke lead, or Z-bend. Right

angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm

(0.200 inch) center spacing are available for through hole

mounting. For more information refer to Standard SMT

and Through Hole Lead Bend Options for Subminiature

LED Lamps data sheet.

Technology

These subminiature solid state lamps utilize one of the

two newly developed aluminum indium gallium phos-

phide (AlInGaP) LED technologies. The HLMT-Devices

are especially effective in very bright ambient lighting

conditions. The colors 590 nm amber, 605 nm orange,

615 nm reddish-orange, 622/626 nm red, and 635 nm red

are available with viewing angles of 15° for the domed

devices and 125° for the flat top devices.

Recommended Resources

Differential Thermometer Sensor Circuit

Buck regulator circuit diagram composed of MAX739

10～20MHz crystal oscillator

bidirectional monostable circuit

Balanced DC amplifier circuit using NPN and PNP

Doubts about the high-frequency equivalent circuit of the triode: [i=s] This post was last edited by 小盼abc on 2016-8-14 16:34 [/i] Why is Ub'e=Ib*rb'e in the high-frequency equivalent circuit of a triode? Logically, shouldn't the current flowing through rb'e be ie? ...; 小盼abc Analog electronics

Can the msp430 processor in the DLP4710 module be removed during mass production?: The msp430 processor in the DLP4710 module is mainly used to configure two display chips and drive the fan. Can this part be removed during mass production?...; zfr Microcontroller MCU

Design of temperature measurement system based on msp430 single chip microcomputer: This article introduces a method of measuring temperature using an msp430 microcontroller to replace the relatively backward experimental method of combining thermistors with ammeters in traditional t...; Jacktang Microcontroller MCU

【VOFA+】 Makes graphical debugging as simple as a serial port assistant: [i=s]This post was last edited by je00 on 2021-3-6 21:25[/i]In the debugging of embedded hardware, despite its low efficiency, engineers have been using command-line-style data transceiver tools such ...; je00 stm32/stm8

New stuff, experts come in.: Has anyone made an emulator for vS2005 under Wince5.0?...; benpao_life Embedded System

Are the currents in a series circuit equal everywhere and the voltages in a parallel circuit equal?: [i=s] This post was last edited by Tianyahaijiaosr on 2016-8-18 12:12 [/i] 1. Under AC conditions, if the three components of resistance, inductance and capacitance are connected in series, will the c...; 天涯海角sr Power technology

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components