BZT52CxxS
SURFACE MOUNT ZENER DIODE
Features
Planar Die Construction
Ultra-Small Surface Mount Package
Ideally suited for Automated Assembly Processes
P/N suffix V means AEC- 101 ualified, e.g:BZT52C2V0SV
P/N suffix V means alogen-free
Mechanical Data
Case: SOD-323, Plastic
Case material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Polarity: Cathode Band
SOD323
Marking Information:
XX = Product Type Marking Code
(See Table Above)
Maximum Ratings
Forward Voltage (Note 2)
Power Dissipation (Note 1)
@ T
A
= 25 C unless otherwise specified
Symbol
@ I = 10mA
V
F
P
d
R
JA
Characteristic
Value
0.9
200
625
-65 to +150
Unit
V
mW
C/W
C
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
T
j,
T
STG
Notes:1. Part mounted on FR-4 PC board with recommended pad layout
2. Short duration test pulse used in minimize self-heating effect.
2019-08 /08
REV:C
RATING AND CHARACTERISTICS CURVES (BZT52C2V0S THRU BZT52C
7
5S )
300
50
T
j
= 25°C
C2V7
C3V9
C5V6
C6V8
C3V3
P
D
, POWER DISSI AT ON (mW)
C4V7
40
I
Z
, ZENER CURRENT (mA)
C8V2
200
30
20
100
10
0
0
100
T , AMBIENT TEMPERATURE, °C
Fi . 1. Power Deratin Curve
200
Test Current I
Z
5.0mA
0
0
1
3
4
5
6
8
9
7
V
Z
, ZENER VOLTAGE (V)
Fi . 2 Zener Breakdown Characteristics
2
10
30
T
j
= 25°C
C10
1000
C12
T
j
= 25 °C
I
Z
, ZENER CURRENT (mA)
20
C15
C
T
, TOTAL CAPAC TANCE (pF)
V
R
= 1V
V
R
= 2V
C18
100
V
R
= 1V
10
Test current I
Z
5mA
C22
C27
C33
C39
C36
V
R
= 2V
0
0
10
20
30
V
Z
, ZENER VOLTAGE (V)
Fi . 3. Zener Breakdown Characteristics
40
10
1
10
100
V
Z
, NOMINAL ZENER VOLTAGE (V)
Fig. 4 Total Capacitance vs Nominal Zener Voltage
PACKAGING OF DIODE AND BRIDGE RECTIFIERS
REEL PACK
PACKAGE
SOD-323
PACKING
EA PER EA PER COMPONENT TAPE SPACE REEL DIA CARTON SIZE EA PER
GROSS
SPACE
INNER
REEL
CARTON WEIGHT(Kg)
CODE
(mm)
(mm)
(mm)
(mm)
BOX
-T
3,000
15,000
---
---
178
390*205*31
120,000
5.17
Microcontroller MCU
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