700 Series
A
Four-Fingered Contacts Disposable Carriers
732-AG4D-ES
FEATURES:
A disposable aluminum carrier forms the backbone of the 700 Series
socket, an innovative extension of the Augat precision four-fingered, inner
contact concept. Conceived for IC applications requiring maximum air
flow for cooling, the 700 Series eliminates heat entrapment associated with
an insulator. Additional benefits are:
• Easy solder joint inspection-easy cleaning-easy repair
• “X” & “Y” stackability for circuit flexibility and optimum use of PCB
real estate
• Gang insertion of socket pins into PC boards
• 100% non-wicking of flux and solder
• Standard or low profile PC board mounting
• Availability in 6 to 40 positions on .100"(2,54) centers and a wide
variety of row spacing
• Machined (Premium Series) and stamped (Economy Series) contacts
are available
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 125 Grams average with .018" (0,46) dia.
polished steel pin (Premium Series)
200 Grams average with .018" (0,46) dia.
polished steel pin (Economy Series)
Inner Contact Retention
in Sleeve .................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic ..................... 3.0 Lbs. per line minimum
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. Premium - 134 Grams (4.7 oz.) average with a
.018" (0,46) dia. polished steel pin
Economy - 179 Grams (6.3 oz.) average with a
.018" (0,46) dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a
(Premium and Economy) .018" (0,46) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC
per MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• IC Pin Dimension Range:.016" to .021" (0,41 to 0,53) dia.,
.105" (2,67) min. length
• PCB Hole Size Range: .035"
±
.003" (0,89
±
0,08) standard mount,
.055
±
.001" (1,40
±
0,03) low profile mount
MATERIAL SPECIFICATIONS:
Carrier ............................ Aluminum
Sleeve ............................ Machined brass
Contact .......................... Beryllium copper
Sleeve Plating ................ Tin/lead or gold
Contact Plating .............. Premium or Economy Series (ES) - gold or
tin/lead
Economy Series (ESL) - low gold
Quality & Innovation From The
Product Group
A12
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
DSP and ARM Processors
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