54AC725FM datasheet, PDF - EEWORLD Datasheet

54AC725FM: DescriptionIC,FIFO,512X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC; Categorystorage storage; File Size889KB，16 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54AC725FM Overview

IC,FIFO,512X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	DFP, FL28,.4
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F28
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	28
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X9
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL28,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	3.3/5 V
Certification status	Not Qualified
Maximum standby current	0.01 A
Maximum slew rate	0.01 mA
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

	54AC725FM	54AC725DM	54AC725LM
Description	IC,FIFO,512X9,ASYNCHRONOUS,AC-CMOS,FP,28PIN,CERAMIC	IC,FIFO,512X9,ASYNCHRONOUS,AC-CMOS,DIP,28PIN,CERAMIC	IC,FIFO,512X9,ASYNCHRONOUS,AC-CMOS,LLCC,32PIN,CERAMIC
package instruction	DFP, FL28,.4	DIP, DIP28,.6	QCCN, LCC32(UNSPEC)
Reach Compliance Code	unknown	unknown	unknown
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9
Number of terminals	28	28	32
word count	512 words	512 words	512 words
character code	512	512	512
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
organize	512X9	512X9	512X9
Package body material	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	DIP	QCCN
Encapsulate equivalent code	FL28,.4	DIP28,.6	LCC32(UNSPEC)
Package form	FLATPACK	IN-LINE	CHIP CARRIER
power supply	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.01 A	0.01 A	0.01 A
Maximum slew rate	0.01 mA	0.01 mA	0.01 mA
surface mount	YES	NO	YES
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	THROUGH-HOLE	NO LEAD
Terminal location	DUAL	DUAL	QUAD
Base Number Matches	1	1	1
Maker	Texas Instruments	-	Texas Instruments
JESD-30 code	R-XDFP-F28	R-XDIP-T28	-
Package shape	RECTANGULAR	RECTANGULAR	-
Terminal pitch	1.27 mm	2.54 mm	-

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