MPC5602BEVLL datasheet, PDF - EEWORLD Datasheet

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MPC5602BEVLL: Description32-BIT, FLASH, 64MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-100; CategoryThe embedded processor and controller Microcontrollers and processors; File Size971KB，72 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MPC5602BEVLL Overview

32-BIT, FLASH, 64MHz, MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-100

MPC5602BEVLL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	QFP
package instruction	14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-100
Contacts	100
Reach Compliance Code	compliant
Has ADC	YES
Other features	ITS ALSO OPERATES AT 5 V
Address bus width
bit size	32
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PQFP-G100
length	14 mm
Number of I/O lines	79
Number of terminals	100
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
power supply	3.3/5 V
Certification status	Not Qualified
RAM (bytes)	24576
rom(word)	262144
ROM programmability	FLASH
Maximum seat height	1.7 mm
speed	64 MHz
Maximum slew rate	150 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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MPC5604B/C

MAPBGA–225

15 mm x 15 mm

QFN12

##_mm_x_##mm

MPC5604B/C

Microcontroller Data Sheet

32-bit MCU family built on the Power Architecture™ for

automotive body electronics applications

Features:

•

Single issue, 32-bit CPU core complex (e200z0)

— Compliant with the Power Architecture™

embedded category

— Includes an instruction set enhancement

allowing variable length encoding (VLE) for

code size footprint reduction. With the optional

encoding of mixed 16-bit and 32-bit

instructions, it is possible to achieve significant

code size footprint reduction.

Up to 512 Kbytes on-chip flash supported with the

flash controller

Up to 48 Kbytes on-chip SRAM

Memory protection unit (MPU) with 8 region

descriptors and 32-byte region granularity

Interrupt controller (INTC) with 148 interrupt

vectors, including 16 external interrupt sources and

18 external interrupt/wakeup sources

Frequency modulated phase-locked loop (FMPLL)

Crossbar switch architecture for concurrent access to

peripherals, flash, or RAM from multiple bus

masters

Boot assist module (BAM) supports internal flash

programming via a serial link (CAN or SCI)

Timer supports input/output channels providing a

range of 16-bit input capture, output compare, and

pulse width modulation functions (eMIOS-lite)

10-bit analog-to-digital converter (ADC)

3 serial peripheral interface (DSPI) modules

Up to 4 serial communication interface (LINFlex)

modules

SOT-343R

##_mm_x_##mm

208 MAPBGA

(17 x 17 x 1.7 mm)

144 LQFP

(20 x 20 x 1.4 mm)

TBD

PKG-TBD

## mm x ## mm

100 LQFP

(14 x 14 x 1.4 mm)

•

Up to 6 enhanced full CAN (FlexCAN) modules

with configurable buffers

1 inter IC communication interface (I2C) module

Up to 123 configurable general purpose pins

supporting input and output operations (package

dependent)

Real Time Counter (RTC) with clock source from

128 kHz or 16 MHz internal RC oscillator

supporting autonomous wakeup with 1 ms

resolution with max timeout of 2 seconds

Up to 6 periodic interrupt timers (PIT) with 32-bit

counter resolution

1 System Module Timer (STM)

Nexus development interface (NDI) per IEEE-ISTO

5001-2003 Class Two Plus standard

Device/board boundary Scan testing supported with

per Joint Test Action Group (JTAG) of IEEE (IEEE

1149.1)

On-chip voltage regulator (VREG) for regulation of

input supply for all internal levels

•

This document contains information on a product under development. Freescale reserves the

right to change or discontinue this product without notice.

Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available

from Freescale for import or sale in the United States prior to September 2010: MPC5604BxMG products in 208 MAPBGA packages

Freescale Semiconductor

Data Sheet: Advance Information

Document Number: MPC5604BC

Rev. 4, 08/2009

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