product brief
Intel
®
Celeron
®
Processor - Low
Power for Applied Computing
Product Highlights
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300 MHz and 400 MHz:
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Built on the Intel 0.18 micron process
128K Full speed on-die L2 cache operating
at core frequency
Low profile, surface mount BGA package
BGA (31 x 27 x 2.5mm), (BGA2)
495 leads in area array
Tcase: 0 to 100C
Ultra-Low Voltage 650 MHz
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650 MHz:
-
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Built on the Intel 0.13 micron process
256K Full speed on-die L2 cache operating at
core frequency
Low profile, surface mount µFCBGA package
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-
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650 MHz processor speed
100 MHz processor side bus
8.3W TDP (max), 7.0W TDP (typ)
Supported with Intel 440MX and Intel 815E
chipsets
-
µFCBGA package (35 x 35 mm)
479 balls in area array
Tcase: 0 to 100C
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Functional features
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Product Overview
The Intel
®
Celeron
®
processors - Low Power,
Ultra Low Power and Ultra Low Voltage now
provide an exceptional value for thermally
sensitive and space constrained applied
computing applications by combining the
optimal balance of cost, performance, and low
power. Available in the small form factor BGA
package at 300 and 400 MHz with 128K of
on-die L2 cache or the µFCBGA package at
650 MHz with 256K of on-die L2 cache. These
features make it ideal for value-based, low-
profile, low-power applied computing
applications, such as data communications,
telecommunications, industrial automation and
transaction terminals.
The 300 MHz processor, at just 1.1V and 5.7
W TDP (max), and the 650 MHz processor,
also at 1.1V and with a 8.3W TDP (max), are
ideal solutions for communication appliances
such as set-top boxes, network attached
storage, web pads and other applications with
lower power envelopes and BOM
requirements.
MMX technology
Floating Point Unit (FPU)
Dynamic Execution Micro-Architecture
On-Die L2 Cache with Error Checking and
Correcting (ECC)
Low Power 400 MHz
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400 MHz processor speed
100 MHz processor side bus
10.1W TDP (max). 6.5 W TDP (typ)
Supported with the Intel
®
815, Intel
®
815E,
Intel
®
440BX AGPset and Intel
®
440MX
Chipsets
Ultra-Low Power 300 MHz
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300 MHz processor speed
100 MHz processor side bus
5.7W TDP (max), 4.2 W TDP (typ)
Supported with the Intel 815, Intel 815E, and the
Intel 440MX Chipsets
Product Description
The Embedded Intel
®
Architecture low power family features a 100 MHz processor side bus, designed for a faster transfer of data,
to yield an increase in performance. The 128K/256K of on-die L2 cache combined with the efficiencies of the 0.18 and 0.13 micron
manufacturing processes offers good low power processor performance for value based systems. The compact form factor results in a
low profile, meeting small space requirement. This enables a variety of value-based designs for thermally sensitive and space
constrained environments.
I N T E L
®
C E L E R O N
®
P R O C E S S O R S - L O W P O W E R , U LT R A L O W P O W E R ,
& U LT R A L O W V O LTA G E
PRODUCT NUMBER
RJ80530VY650256
KC80526LY400128
KC80526LL300128
CORE SPEED
CORE SPEED
(MHz)
650
400
300
EXTERNAL
EXTERNAL
BUS SPEED (MHz)
100
100
100
L2
L2
CACHE
THERMAL DESIGN
POWER (MAX)
VOLTAGE
1.1V
1.35V
1.1V
T
CASE
0-100C
0-100C
0-100C
PACKAGE
479 µFCBGA
495 BGA
495 BGA
256K
8.3 watts
128K
10.1 watts
128K
5.7 watts
THERMAL DESIGN
Intel Access
Developer’s Site
Embedded Intel
®
Architecture Home Page
Other Intel Support:
Intel Literature Center
General Information Hotline
developer.intel.com
developer.intel.com/design/intarch
developer.intel.com/design/litcentr
(800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada)
International locations please contact your local sales office.
(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise,
to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such
products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel
products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent,
copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
Intel, the Intel logo, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or
other countries.
*Other names and brands may be claimed as the property of others.
For more information, visit the Intel Web site at:
developer.intel.com
UNITED STATES AND CANADA
Intel Corporation
Robert Noyce Bldg.
2200 Mission College Blvd.
P.O. Box 58119
Santa Clara, CA 95052-8119
USA
© Intel Corporation 2002
Printed on Recycled Paper
EUROPE
Intel Corporation (UK) Ltd.
Pipers Way
Swindon
Wiltshire SN3 1RJ
UK
ASIA-PACIFIC
Intel Semiconductor Ltd.
32/F Two Pacific Place
88 Queensway, Central
Hong Kong, SAR
JAPAN
Intel Kabushiki Kaisha
P.O. Box 115 Tsukuba-gakuen
5-6 Tokodai, Tsukuba-shi
Ibaraki-ken 305
Japan
SOUTH AMERICA
Intel Semicondutores do Brazil
Rue Florida, 1703-2 and CJ22
CEP 04565-001 Sao Paulo-SP
Brazil
Order Number: 273348-003 Printed in USA/0502/LM/AvM/IL20707C/500
Microcontroller MCU
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