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KD82750DB-28

Description
Graphics Processor, CMOS, PQFP132, PLASTIC, QFP-132
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,56 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

KD82750DB-28 Overview

Graphics Processor, CMOS, PQFP132, PLASTIC, QFP-132

KD82750DB-28 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeQFP
package instructionBQFP,
Contacts132
Reach Compliance Codecompliant
maximum clock frequency28 MHz
External data bus width32
JESD-30 codeS-PQFP-G132
JESD-609 codee0
length24.13 mm
Maximum number of bits per pixel32
Number of terminals132
Maximum operating temperature95 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBQFP
Package shapeSQUARE
Package formFLATPACK, BUMPER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum slew rate375 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width24.13 mm
uPs/uCs/peripheral integrated circuit typeGRAPHICS PROCESSOR
Base Number Matches1

KD82750DB-28 Related Products

KD82750DB-28 KD82750DB-45
Description Graphics Processor, CMOS, PQFP132, PLASTIC, QFP-132 Graphics Processor, CMOS, PQFP132, PLASTIC, QFP-132
Is it Rohs certified? incompatible incompatible
Maker Intel Intel
Parts packaging code QFP QFP
package instruction BQFP, BQFP,
Contacts 132 132
Reach Compliance Code compliant compliant
maximum clock frequency 28 MHz 45 MHz
External data bus width 32 32
JESD-30 code S-PQFP-G132 S-PQFP-G132
JESD-609 code e0 e0
length 24.13 mm 24.13 mm
Maximum number of bits per pixel 32 32
Number of terminals 132 132
Maximum operating temperature 95 °C 95 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BQFP BQFP
Package shape SQUARE SQUARE
Package form FLATPACK, BUMPER FLATPACK, BUMPER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified
Maximum seat height 4.572 mm 4.572 mm
Maximum slew rate 375 mA 375 mA
Maximum supply voltage 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V
surface mount YES YES
technology CMOS CMOS
Temperature level OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING
Terminal pitch 0.635 mm 0.635 mm
Terminal location QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 24.13 mm 24.13 mm
uPs/uCs/peripheral integrated circuit type GRAPHICS PROCESSOR GRAPHICS PROCESSOR
Base Number Matches 1 1
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