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BZT52C39S-TP-HF

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size303KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

BZT52C39S-TP-HF Overview

Zener Diode,

BZT52C39S-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
package instructionSOD-323, 2 PIN
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance130 Ω
Maximum forward voltage (VF)0.9 V
JESD-30 codeR-PDSO-G2
Maximum knee impedance350 Ω
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.2 W
Nominal reference voltage39 V
Maximum reverse current0.1 µA
Reverse test voltage27.3 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature10
Voltage temperatureCoeff-Max41.2 mV/°C
Maximum voltage tolerance5%
Working test current2 mA
Base Number Matches1
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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BZT52C2V4S
THRU
BZT52C39S
200 mW
Zener Diode
2.4 to 39 Volts
Features
Planar Die Construction
200mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Halogen
free available upon request by adding suffix "-HF"
SOD-323
A
B
Unit
mW
Absolute Maximum Ratings
Symbol
P
D
T
J
T
STG
Parameter
Power dissipation
Junction Temperature
Storage Temperature Range
Rating
200
-65 to +150
-65 to +150
C
E
H
D
Absolute Maximum Ratings
Symbol
R
thJA
Parameter
Thermal Resistance Junction to
Ambient*
Rating
625
Unit
G
J
DIM
/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25
mm
2
Electrical Characteristics
Symbol
Parameter
Rating
Unit
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.090
.107
2.30
2.70
.063
.071
1.60
1.80
.045
.053
1.15
1.35
.031
.045
0.80
1.15
.010
.016
0.25
0.40
.004
.018
0.10
0.45
.004
.010
0.10
0.25
-----
.006
-----
0.15
SUGGESTED SOLDER
PAD LAYOUT
NOTE
V
F
Maximum Forward Voltage
(I
F
=10mAdc)
0.9
V
0.074"
0.027”
0.022”
Revision:
B
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