LFXP10C-3T144C datasheet, PDF - EEWORLD Datasheet

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LFXP10C-3T144C: DescriptionField Programmable Gate Array, 1216 CLBs, CMOS, PQFP144, 20 X 20 MM, PLASTIC, TQFP-144; CategoryProgrammable logic devices Programmable logic; File Size7MB，386 Pages; ManufacturerLattice; Websitehttp://www.latticesemi.com

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LFXP10C-3T144C Overview

Field Programmable Gate Array, 1216 CLBs, CMOS, PQFP144, 20 X 20 MM, PLASTIC, TQFP-144

LFXP10C-3T144C Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Lattice
Parts packaging code	QFP
package instruction	20 X 20 MM, PLASTIC, TQFP-144
Contacts	144
Reach Compliance Code	not_compliant
ECCN code	EAR99
JESD-30 code	S-PQFP-G144
JESD-609 code	e0
length	20 mm
Humidity sensitivity level	3
Configurable number of logic blocks	1216
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature
organize	1216 CLBS
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	225
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Certification status	Not Qualified
Maximum supply voltage	3.3 V
Minimum supply voltage	1.8 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	20 mm
Base Number Matches	1

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LatticeXP Family Handbook

HB1001 Version 02.9, April 2007

LatticeXP Family Handbook

Table of Contents

April 2007

Section I. LatticeXP Family Data Sheet

Introduction

Features ............................................................................................................................................................. 1-1

Introduction ........................................................................................................................................................ 1-2

Architecture

Architecture Overview ........................................................................................................................................ 2-1

PFU and PFF Blocks................................................................................................................................. 2-2

Slice .......................................................................................................................................................... 2-3

Routing...................................................................................................................................................... 2-6

Clock Distribution Network ................................................................................................................................. 2-6

Primary Clock Sources.............................................................................................................................. 2-6

Secondary Clock Sources......................................................................................................................... 2-7

Clock Routing............................................................................................................................................ 2-8

sysCLOCK Phase Locked Loops (PLLs) .................................................................................................. 2-9

Dynamic Clock Select (DCS) ........................................................................................................................... 2-11

sysMEM Memory ............................................................................................................................................. 2-11

sysMEM Memory Block........................................................................................................................... 2-11

Bus Size Matching .................................................................................................................................. 2-12

RAM Initialization and ROM Operation ................................................................................................... 2-12

Memory Cascading ................................................................................................................................. 2-12

Single, Dual and Pseudo-Dual Port Modes............................................................................................. 2-12

Memory Core Reset ................................................................................................................................ 2-14

Programmable I/O Cells (PICs)........................................................................................................................ 2-15

PIO .......................................................................................................................................................... 2-16

DDR Memory Support...................................................................................................................................... 2-20

DLL Calibrated DQS Delay Block ........................................................................................................... 2-20

Polarity Control Logic .............................................................................................................................. 2-22

sysIO Buffer ..................................................................................................................................................... 2-22

Hot Socketing.......................................................................................................................................... 2-25

Sleep Mode ...................................................................................................................................................... 2-25

SLEEPN Pin Characteristics ................................................................................................................... 2-26

Configuration and Testing ................................................................................................................................ 2-26

IEEE 1149.1-Compliant Boundary Scan Testability................................................................................ 2-26

Device Configuration............................................................................................................................... 2-26

Internal Logic Analyzer Capability (ispTRACY)....................................................................................... 2-27

Oscillator ................................................................................................................................................. 2-27

Density Shifting ................................................................................................................................................ 2-28

DC and Switching Characteristics

Absolute Maximum Ratings ............................................................................................................................... 3-1

Recommended Operating Conditions ................................................................................................................ 3-1

Hot Socketing Specifications.............................................................................................................................. 3-2

DC Electrical Characteristics.............................................................................................................................. 3-3

Supply Current (Sleep Mode)............................................................................................................................. 3-3

Supply Current (Standby)................................................................................................................................... 3-4

Initialization Supply Current ............................................................................................................................... 3-5

Programming and Erase Flash Supply Current ................................................................................................. 3-6

sysIO Recommended Operating Conditions...................................................................................................... 3-7

sysIO Single-Ended DC Electrical Characteristics............................................................................................. 3-8

or product names are trademarks or registered trademarks of their respective holders. The speciﬁcations and information herein are subject to change without notice.

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Lattice Semiconductor

Table of Contents

LatticeXP Family Handbook

sysIO Differential Electrical Characteristics ....................................................................................................... 3-9

LVDS......................................................................................................................................................... 3-9

Differential HSTL and SSTL............................................................................................................................. 3-10

LVDS25E ................................................................................................................................................ 3-10

BLVDS .................................................................................................................................................... 3-10

LVPECL .................................................................................................................................................. 3-12

RSDS ...................................................................................................................................................... 3-12

Typical Building Block Function Performance.................................................................................................. 3-14

Pin-to-Pin Performance (LVCMOS25 12 mA Drive) ............................................................................... 3-14

Register to Register Performance........................................................................................................... 3-14

Derating Logic Timing ...................................................................................................................................... 3-15

LatticeXP External Switching Characteristics .................................................................................................. 3-16

LatticeXP Internal Timing Parameters ............................................................................................................. 3-18

Timing Diagrams .............................................................................................................................................. 3-20

PFU Timing Diagrams............................................................................................................................. 3-20

EBR Memory Timing Diagrams........................................................................................................................ 3-21

LatticeXP Family Timing Adders ...................................................................................................................... 3-23

sysCLOCK PLL Timing .................................................................................................................................... 3-25

LatticeXP sysCONFIG Port Timing Specifications........................................................................................... 3-26

Flash Download Time ...................................................................................................................................... 3-27

JTAG Port Timing Specifications ..................................................................................................................... 3-27

Switching Test Conditions................................................................................................................................ 3-28

Pinout Information

Signal Descriptions ............................................................................................................................................ 4-1

PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin .................................................... 4-3

Pin Information Summary................................................................................................................................... 4-4

Power Supply and NC Connections................................................................................................................... 4-6

LFXP3 Logic Signal Connections: 100 TQFP .................................................................................................... 4-7

LFXP3 & LFXP6 Logic Signal Connections: 144 TQFP................................................................................... 4-10

LFXP3 & LFXP6 Logic Signal Connections: 208 PQFP .................................................................................. 4-14

LFXP6 & LFXP10 Logic Signal Connections: 256 fpBGA................................................................................ 4-19

LFXP15 & LFXP20 Logic Signal Connections: 256 fpBGA.............................................................................. 4-26

LFXP10, LFXP15 & LFXP20 Logic Signal Connections: 388 fpBGA............................................................... 4-34

LFXP15 & LFXP20 Logic Signal Connections: 484 fpBGA.............................................................................. 4-43

Ordering Information

Part Number Description.................................................................................................................................... 5-1

Ordering Information .......................................................................................................................................... 5-1

Conventional Packaging ........................................................................................................................... 5-2

Lead-free Packaging ................................................................................................................................. 5-8

Supplemental Information

For Further Information ...................................................................................................................................... 6-1

Revision History

Revision History ................................................................................................................................................. 7-1

Section II. LatticeXP Family Technical Notes

LatticeECP/EC and LatticeXP sysIO Usage Guide

Introduction ........................................................................................................................................................ 8-1

sysIO Buffer Overview ....................................................................................................................................... 8-1

Supported sysIO Standards ............................................................................................................................... 8-1

sysIO Banking Scheme...................................................................................................................................... 8-2

CCIO

(1.2V/1.5V/1.8V/2.5V/3.3V) ............................................................................................................ 8-3

CCAUX

(3.3V) ........................................................................................................................................... 8-3

CCJ

(1.2V/1.5V/1.8V/2.5V/3.3V).............................................................................................................. 8-3

Input Reference Voltage (V

REF1,

REF2

)................................................................................................... 8-3

REF1

for DDR Memory Interface ............................................................................................................. 8-3

Lattice Semiconductor

Table of Contents

LatticeXP Family Handbook

Mixed Voltage Support in a Bank.............................................................................................................. 8-4

sysIO Standards Supported in Each Bank......................................................................................................... 8-5

LVCMOS Buffer Configurations ......................................................................................................................... 8-5

Programmable Pull-up/Pull-Down/Buskeeper........................................................................................... 8-5

Programmable Drive ................................................................................................................................. 8-5

Programmable Slew Rate ......................................................................................................................... 8-7

Open Drain Control ................................................................................................................................... 8-7

Differential SSTL and HSTL Support ................................................................................................................. 8-7

PCI Support with Programmable PCICLAMP .................................................................................................... 8-7

5V Interface with PCI Clamp Diode.................................................................................................................... 8-8

Programmable Input Delay ................................................................................................................................ 8-9

Software sysIO Attributes................................................................................................................................... 8-9

IO_TYPE ................................................................................................................................................... 8-9

OPENDRAIN........................................................................................................................................... 8-10

DRIVE ..................................................................................................................................................... 8-10

PULLMODE ............................................................................................................................................ 8-11

PCICLAMP.............................................................................................................................................. 8-11

SLEWRATE ............................................................................................................................................ 8-11

FIXEDDELAY.......................................................................................................................................... 8-11

DIN/DOUT............................................................................................................................................... 8-11

LOC......................................................................................................................................................... 8-12

Design Considerations and Usage................................................................................................................... 8-12

Banking Rules ......................................................................................................................................... 8-12

Differential I/O Rules ............................................................................................................................... 8-12

Assigning V

REF

/ V

REF

Groups for Referenced Inputs............................................................................. 8-12

Differential I/O Implementation......................................................................................................................... 8-13

LVDS....................................................................................................................................................... 8-13

BLVDS .................................................................................................................................................... 8-13

RSDS ...................................................................................................................................................... 8-13

LVPECL .................................................................................................................................................. 8-13

Differential SSTL and HSTL.................................................................................................................... 8-13

Technical Support Assistance.......................................................................................................................... 8-13

Appendix A. HDL Attributes for Synplify

and Precision

RTL Synthesis ........................................................ 8-14

VHDL Synplify/Precision RTL Synthesis.......................................................................................................... 8-14

Syntax ..................................................................................................................................................... 8-14

Examples ................................................................................................................................................ 8-14

Verilog for Synplify ........................................................................................................................................... 8-17

Syntax ..................................................................................................................................................... 8-17

Examples ................................................................................................................................................ 8-17

Verilog for Precision RTL Synthesis................................................................................................................. 8-19

Syntax ..................................................................................................................................................... 8-19

Example .................................................................................................................................................. 8-19

Appendix B. sysIO Attributes Using Preference Editor User Interface............................................................. 8-21

Appendix C. sysIO Attributes Using Preference File (ASCII File) .................................................................... 8-22

IOBUF ..................................................................................................................................................... 8-22

LOCATE.................................................................................................................................................. 8-22

USE DIN CELL........................................................................................................................................ 8-23

USE DOUT CELL.................................................................................................................................... 8-23

PGROUP VREF ...................................................................................................................................... 8-23

Memory Usage Guide for LatticeECP/EC and LatticeXP Devices

Introduction ........................................................................................................................................................ 9-1

Memories in LatticeECP/EC and LatticeXP Devices ......................................................................................... 9-1

Utilizing IPexpress.............................................................................................................................................. 9-3

IPexpress Flow.......................................................................................................................................... 9-3

Lattice Semiconductor

Table of Contents

LatticeXP Family Handbook

Memory Modules................................................................................................................................................ 9-7

Single Port RAM (RAM_DQ) – EBR Based .............................................................................................. 9-7

True Dual Port RAM (RAM_DP_TRUE) – EBR Based ........................................................................... 9-13

Pseudo Dual Port RAM (RAM_DP) – EBR-Based.................................................................................. 9-22

Read Only Memory (ROM) – EBR Based............................................................................................... 9-25

First In First Out (FIFO, FIFO_DC) – EBR Based................................................................................... 9-28

Distributed Single Port RAM (Distributed_SPRAM) – PFU Based.......................................................... 9-32

Distributed Dual Port RAM (Distributed_DPRAM) – PFU Based ............................................................ 9-35

Distributed ROM (Distributed_ROM) – PFU Based ................................................................................ 9-37

Initializing Memory ........................................................................................................................................... 9-39

Initialization File Format .......................................................................................................................... 9-39

Technical Support Assistance.......................................................................................................................... 9-41

Appendix A. Attribute Definitions...................................................................................................................... 9-42

DATA_WIDTH......................................................................................................................................... 9-42

REGMODE.............................................................................................................................................. 9-42

RESETMODE ......................................................................................................................................... 9-42

CSDECODE............................................................................................................................................ 9-42

WRITEMODE.......................................................................................................................................... 9-42

GSR ........................................................................................................................................................ 9-42

LatticeECP/EC and LatticeXP DDR Usage Guide

Introduction ...................................................................................................................................................... 10-1

DDR SDRAM Interfaces Overview................................................................................................................... 10-1

Implementing DDR Memory Interfaces with the LatticeECP/EC Devices........................................................ 10-2

DQS Grouping......................................................................................................................................... 10-2

DDR Software Primitives......................................................................................................................... 10-5

Memory Read Implementation ................................................................................................................ 10-9

Data Read Critical Path......................................................................................................................... 10-12

DQS Postamble .................................................................................................................................... 10-13

Memory Write Implementation .............................................................................................................. 10-14

Design Rules/Guidelines....................................................................................................................... 10-16

QDR II Interface .................................................................................................................................... 10-17

FCRAM (Fast Cycle Random Access Memory) Interface..................................................................... 10-17

Generic High Speed DDR Implementation .................................................................................................... 10-17

Board Design Guidelines ............................................................................................................................... 10-17

Technical Support Assistance........................................................................................................................ 10-18

Appendix A. Using IPexpress™ to Generate DDR Modules.......................................................................... 10-19

DDR Generic......................................................................................................................................... 10-19

DDR Memory Interface ......................................................................................................................... 10-20

Appendix B. Verilog Example for DDR Input and Output Modules ................................................................ 10-21

Appendix C. VHDL Example for DDR Input and Output Modules.................................................................. 10-23

Appendix D. Generic (Non-Memory) High-Speed DDR Interface .................................................................. 10-28

VHDL Implementation ........................................................................................................................... 10-28

Verilog Example .................................................................................................................................... 10-30

Preference File...................................................................................................................................... 10-31

Appendix E. List of Compatible DDR SDRAM ............................................................................................... 10-32

Appendix F. DDR400 Interface using the LatticeEC Evaluation Board.......................................................... 10-35

References..................................................................................................................................................... 10-36

LatticeECP/EC and LatticeXP sysCLOCK PLL Design and Usage Guide

Introduction ...................................................................................................................................................... 11-1

Features ........................................................................................................................................................... 11-1

Functional Description...................................................................................................................................... 11-1

PLL Divider and Delay Blocks................................................................................................................. 11-1

PLL Inputs and Outputs .......................................................................................................................... 11-2

PLL Attributes.......................................................................................................................................... 11-3

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