M29KW032E100ZA1 datasheet, PDF

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M29KW032E100ZA1: Description2MX16 FLASH 12V PROM, 100ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, TFBGA-48; Categorystorage storage; File Size274KB，31 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M29KW032E100ZA1 Overview

2MX16 FLASH 12V PROM, 100ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, TFBGA-48

M29KW032E100ZA1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	6 X 9 MM, 0.80 MM PITCH, TFBGA-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Maximum access time	100 ns
command user interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	9 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	16
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	12 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	128K
Maximum standby current	0.0001 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	6 mm
Base Number Matches	1

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M29KW032E

32 Mbit (2Mb x16, Uniform Block)

3V Supply LightFlash™ Memory

FEATURES SUMMARY

■

SUPPLY VOLTAGE

– V

= 2.7V to 3.6V for Read

– V

= 11.4V to 12.6V for Program and

Erase

■

ACCESS TIME:

– 90ns at V

= 3.0V to 3.6V

– 100ns at V

= 2.7V to 3.6V

■

PROGRAMMING TIME

– 9µs per Word typical

– Multiple Word Programming Option (4s

typical Chip Program)

■

ERASE TIME

– 21s typical factory Chip Erase

■

UNIFORM BLOCKS

– 16 blocks of 2 Mbits

■

PROGRAM/ERASE CONTROLLER

– Embedded Word Program algorithms

■

10,000 PROGRAM/ERASE CYCLES per

BLOCK

■

ELECTRONIC SIGNATURE

– Manufacturer Code: 0020h

– Device Code : 88ACh

Figure 1. Packages

TSOP48 (N)

12 x 20mm

FBGA

TFBGA48 (ZA)

6 x 9mm

March 2004

1/31

M29KW032E

Table 5.

Table 6.

Table 7.

Figure 5.

Multiple Word Program Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Program, Erase Times and Program, Erase Endurance Cycles . . . . . . . . . . . . . . . . . . . 12

Multiple Word Program Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Multiple Word Program Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

VPP Status Bit (DQ4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Alternative Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Multiple Word Program Bit (DQ0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Status Register Bit DQ1 is reserved.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 8. Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 6. Data Polling Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 7. Data Toggle Flowchart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 9. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

DC and AC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 10. Operating and AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 8. AC Measurement I/O Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Figure 9. AC Measurement Load Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 11. Device Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 12. DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Figure 10.Read AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 13. Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Figure 11.Write AC Waveforms, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 14. Write AC Characteristics, Write Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 12.Write AC Waveforms, Chip Enable Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 15. Write AC Characteristics, Chip Enable Controlled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 13.Reset AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 16. Reset AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 14.TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Outline . . . . . . . . . 25

Figure 15.TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20mm, Package Mechanical Data . 25

Figure 16.TFBGA48 6x9mm - 8x6 ball array, 0.80 mm pitch, Bottom View Package Outline. . . . . 26

Table 17. TFBGA48 6x9mm - 8x6 ball array, 0.80 mm pitch, Package Mechanical Data. . . . . . . . 26

Figure 17.TFBGA48 Daisy Chain - Package Connections (Top view through package) . . . . . . . . 27

Figure 18.TFBGA48 Daisy Chain - PCB Connections (Top view through package) . . . . . . . . . . . . 28

PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

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M29KW032E100ZA1 Related Products

	M29KW032E100ZA1	M29KW032E100N1
Description	2MX16 FLASH 12V PROM, 100ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, TFBGA-48	2MX16 FLASH 12V PROM, 100ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48
Is it Rohs certified?	conform to	incompatible
Parts packaging code	BGA	TSOP
package instruction	6 X 9 MM, 0.80 MM PITCH, TFBGA-48	12 X 20 MM, PLASTIC, TSOP-48
Contacts	48	48
Reach Compliance Code	unknown	not_compliant
ECCN code	3A991.B.1.A	3A991.B.1.A
Maximum access time	100 ns	100 ns
command user interface	YES	YES
Data polling	YES	YES
JESD-30 code	R-PBGA-B48	R-PDSO-G48
JESD-609 code	e1	e0
length	9 mm	18.4 mm
memory density	33554432 bit	33554432 bit
Memory IC Type	FLASH	FLASH
memory width	16	16
Number of functions	1	1
Number of departments/size	16	16
Number of terminals	48	48
word count	2097152 words	2097152 words
character code	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	2MX16	2MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TSOP1
Encapsulate equivalent code	BGA48,6X8,32	TSSOP48,.8,20
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	3/3.3 V
Programming voltage	12 V	12 V
Certification status	Not Qualified	Not Qualified
ready/busy	YES	YES
Maximum seat height	1.2 mm	1.2 mm
Department size	128K	128K
Maximum standby current	0.0001 A	0.0001 A
Maximum slew rate	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Lead (Sn/Pb)
Terminal form	BALL	GULL WING
Terminal pitch	0.8 mm	0.5 mm
Terminal location	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
switch bit	YES	YES
type	NOR TYPE	NOR TYPE
width	6 mm	12 mm
Base Number Matches	1	1

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