AXS1
HIGH RELIABILITY
IC SOCKET
WITH ROUND PIN
(SEALED TYPE)
FEATURES
1. Sealed IC sockets compatible with
ultrasonic cleaning (30 seconds),
3-bath cleaning (boiling, ultrasonic,
vapor) and hot water.
2. The top surface of the socket is
sealed by the hot melt method for high
bonding strength.
3. High reliability sockets with round
pin contacts and a 4-point contact
construction.
4. Compliance with RoHS’ Directive
Environmentally friendly, the connectors’
comply with Europe’s RoHS’ Directive.
Cadmium, lead, mercury, hexavalent,
chromium, PBB and PBDE are not used.
ROUND PIN TYPE
SEALED IC SOCKETS
(AXS1)
CONSTRUCTION
Sealing tape is bonded to the top surface
of the IC socket. The sealing tape is
peeled off before IC chip insertion.
Max. 1mm
Hot melt type sealing tape
(Soft stamp pressing the
hot melt sealing tape increasea
the bonding strength)
Tape peel-off
tab
µIC
socket
Construction of sealing tape
Base material layer
(Polyester resin with excellent heat
and chemical resistance.)
Adhesive layer (Polyester resin)
ORDERING INFORMATION
AXS
11: Round PIN type sealed IC sockets
<No. of contacts (2 digits)>
08: 8 contacts 14: 14 contacts
20: 20 contacts 22: 22 contacts
32: 32 contacts 36: 36 contacts
64: 64 contacts
16: 16 contacts
24: 24 contacts
40: 40 contacts
18: 18 contacts
28: 28 contacts
48: 48 contacts
<Terminal layout and shape>
1: DIL terminal layout, solder DIP terminal
7: DIL terminal layout, solder DIP terminal (24 contacts: row pitch is 7.62 mm)
<Surface treatment (Internal contact/External sleeve)>
1: Au plating 0.25µm/Sn plating
3: Au plating 0.76µm/Sn plating
9: Sn plating/Sn plating
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
AXS1
PRODUCT TYPES
Item
External sleeve
Internal contact
Type
No. of contacts
8
14
16
18
20
22
24
*1
DIL
24
*2
28
32
36
40
48
64
*1 Pitch: 15.24mm
*2 Pitch: 7.62mm
Note) All are tray packed sockets
Economical type
(Extremely resistant to
fretting with IC)
General-purpose type
(Extremely resistant to
fretting with IC)
Sn plating
Au plating (0.25µm)
Part No.
AXS110811
AXS111411
AXS111611
AXS111811
AXS112011
AXS112211
AXS112411
AXS112471
AXS112811
AXS113211
AXS113611
AXS114011
AXS114811
AXS116411
High-reliability type
(Contact resistance is stable
even if left unadhered for
extended periods.
Au plating (0.76µm)
Part No.
AXS110813
AXS111413
AXS111613
AXS111813
AXS112013
AXS112213
AXS112413
AXS112473
AXS112813
AXS113213
AXS113613
AXS114013
AXS114813
AXS116413
Quantity in box
Sn plating
Part No.
AXS110819
AXS111419
AXS111619
AXS111819
AXS112019
AXS112219
AXS112419
AXS112479
AXS112819
AXS113219
AXS113619
AXS114019
AXS114819
AXS116419
Inner carton
60 pcs.
Outer carton
600 pcs.
30 pcs.
300 pcs.
20 pcs.
200 pcs.
SPECIFICATIONS AND DIMENSIONS
1. The specification of the sealed IC socket are the same as the round pin type IC socket.
2. See the DIL solder-dip type for the socket and PC board pattern dimensions.
NOTES FOR SEALED TYPE
1. Storage
1) Store at an ambient temperature of
60°C or lower.
2) Do not peel off the tape until after
cleaning. (If the tape is peeled off before
cleaning, the cleaning liquid will enter the
inside of the contact.)
2. Cleaning
Observe the following conditions when
cleaning.
1) Cleaning time
Boiling bath: within 30 seconds
Vapor bath: within 30 seconds
Ultrasonic bath: within 30 seconds
2) Use a cleaning liquid that will not
dissolve polyester. Also, keep the
temperature of the cleaning liquid at 40°C
or lower.
3. After cleaning, peel off the tape and
insert the IC.
Please see (page 237) above for other
notes.
Regarding general notes, please refer
to page 12.
For other details, please verify with the
product specification sheets.
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
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