64K X 8 OTP CMOS EPROM

| A276308A | A276308A-70 | A276308AL-55 | A276308A-55 | A276308A-90 | A276308AL-70 | A276308AL-90 | |
|---|---|---|---|---|---|---|---|
| Description | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM | 64K X 8 OTP CMOS EPROM |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | - | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] | AMICC [AMIC TECHNOLOGY] |
| package instruction | - | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | unknow | unknow |
| Maximum access time | - | 70 ns | 55 ns | 55 ns | 90 ns | 70 ns | 90 ns |
| I/O type | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | - | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 |
| length | - | 37.08 mm | 13.97 mm | 37.08 mm | 37.08 mm | 13.97 mm | 13.97 mm |
| memory density | - | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi |
| memory width | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 28 | 32 | 28 | 28 | 32 | 32 |
| word count | - | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| character code | - | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| Operating mode | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | - | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | DIP | QCCJ | DIP | DIP | QCCJ | QCCJ |
| Encapsulate equivalent code | - | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | DIP28,.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 5.33 mm | 3.4 mm | 5.33 mm | 5.33 mm | 3.4 mm | 3.4 mm |
| Maximum standby current | - | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| Maximum slew rate | - | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | NO | YES | NO | NO | YES | YES |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | - | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
| Terminal pitch | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | - | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD |
| width | - | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 |