BALL GRID ARRAYS
For 0.8mm Grid
Male Pin Adapters & Female Socket
•
BGA adapter/socket systems are a reliable way to make BGAs
pluggable, they may also be used as a
high density board-to-board interconnect.
•
The BGA device is soldered to a 9929
adapter (or a 7929 adapter is soldered
to a PCB); and then either one can be
plugged into a 9645 surface mount socket.
•
Both socket and adapter have the same
footprint as the BGA device.
•
Insertion force is only .4N per pin, and a pry-bar tool
(part #828-01-010) is available for extraction.
•
Insulator material is FR-4 epoxy having a TCE to match the BGA
device and circuit board.
•
Mill-Max offers the option of having the solder surfaces of the 7929
adapter pre-tinned, the 9645 socket is pre-tinned as standard.
BGA MOUNT
ADAPTER PIN TYPE 9929
Series 5XX
Ordering Information
FOR BGA MOUNT ADAPTERS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
Series
Plating
Code
Window
.024 DIA.
.047
.010 DIA.
.054
.123
5 9 9
-
1 0
-
No. of pins
-
-
Grid size
Pattern #
4 2 9
Determined from footprint pattern on page 111.2
PRINTED CIRCUIT MOUNT
ADAPTER PIN TYPE 7929
FOR PCB MOUNT ADAPTERS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
Series
PRE-TINNED
OPTION
Plating
Code
Window
5 7 9
5 9 6
.024 DIA.
.047
.010 DIA.
.018
.054
.141
-
-
1 0
1 0
-
-
No. of pins
-
-
10
10µ” Au
-
-
Grid size
Pattern #
4 2 9
4 6 1
PRE-
TINNED
Determined from footprint pattern on page 111.2
PLATING CODE XX=
Pin Plating
SURFACE MOUNT
RECEPTACLE TYPE 9645
FOR FEMALE SOCKETS
Locate footprint pattern from page 111.2, the middle 8 digits of the part
number will be located under the pattern.
Series
Plating
Code
Window
.027 DIA.
.047
.024 DIA.
.025
.090
PRE-TINNED
STANDARD
5 9 6
-
1 1
-
No. of pins
-
11
10µ” Au
10µ” Au
-
Grid size
Pattern #
4 4 5
Determined from footprint pattern on page 111.2
SPECIFY PLATING CODE XX=
Sleeve (Pin)
Contact (Clip)
w w w. m i l l - m a x . c o m
111.1
516-922-6000
BALL GRID ARRAY FOOTPRINTS (0.8mm GRID)
Top view shown. Many other standard footprints are available.
Visit
www.mill-max.com
for a complete selection.
.035 TYP.
0.8mm TYP.
11 X 11
XXX-XX-100-06-001
13 X 13
XXX-XX-144-07-001
13 X 13
XXX-XX-169-07-001
14 X 14
XXX-XX-131-07-001
14 X 14
XXX-XX-179-07-001
14 X 14
XXX-XX-196-07-001
15 X 15
XXX-XX-225-08-001
18 X 18
XXX-XX-324-09-001
20 X 20
XXX-XX-400-10-007
22 X 22
XXX-XX-484-11-000
23 X 23
XXX-XX-424-12-001
26 X 26
XXX-XX-676-13-001
SPECIFICATIONS:
Materials:
- Socket contact: Three finger, stamped beryllium
copper alloy 172, HT (Mill-Max type #04); plated 10µ”
gold over 50µ” nickel
- Socket shell and adapter pins: Precision machined
brass alloy; plated 10µ” gold over 100µ” nickel
- Insulator material: .047” thick glass-epoxy type FR-4,
rated UL94V-0.
TCE = 10-13ppm/°C,
ε
r = 5.0
Mechanical:
- Insertion and withdrawal forces (using .010” dia.
polished steel gage pin): Insertion: .36N typ. per pin
Withdrawal: .20N typ. per pin
- Insertion force of an actual 225 pin device: 90N
- Durability: 100 cycles
- Coplanarity: <.005”
Electrical:
- Current rating (per pin): 1 A
- Working voltage: 100 VRMS/150 VDC max.
- Low level contact resistance: 10 mΩ max.
- Insulation resistance @ 500 VRMS:
Initial value: 1,000,000 MΩ min.
After climatic tests: 10,000 MΩ min.
- Dielectric withstanding voltage: 500 VRMS
- Capacitance between adjacent contacts: 1 pF max.
- Self inductance per pin: 2 nH max.
- Electrical length: 31 pS
Environmental:
- Operating temperature range: -55 °C to +125 °C
BGA adapter/socket systems have withstood the following
environmental tests without mechanical or electrical failure:
- Damp heat, steady state: 40 °C, 93% rH, 21 days
- Damp heat, cyclic: 25/55 °C, 6 days
- Dry heat: 100°C, 1,000 hours
- Thermal shock: -55 to +125 °C, 5 cycles
- Random vibration: 50 to 500 Hz, 8g, 20 min. per axis
- Shock: 50 g per axis
- Solderability: 235 °C, 2 seconds
- Resistance to soldering heat: 270 °C, 10 seconds
- Resistance to corrosion:
Salt spray: 48 hours
Sulphur dioxide: 96 hours @ 25 ppm SO2, 25 °C, 75% rH
Hydrogen sulphide: 96 hours @ 12 ppm H2S, 25°C, 75% rH
w w w. m i l l - m a x . c o m
111.2
516-922-6000
DSP and ARM Processors
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