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XC2V6000-4CS144C

Description
FPGA, 768 CLBS, 500000 GATES, 750 MHz, PBGA256
Categorysemiconductor    Programmable logic devices   
File Size2MB,318 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Download Datasheet Parametric View All

XC2V6000-4CS144C Overview

FPGA, 768 CLBS, 500000 GATES, 750 MHz, PBGA256

XC2V6000-4CS144C Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals256
Maximum supply/operating voltage1.58 V
Minimum supply/operating voltage1.42 V
Rated supply voltage1.5 V
Processing package description17 × 17 MM, 1 MM PITCH, MO-034AAF-1, FBGA-256
stateDISCONTINUED
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeGRID array
surface mountYes
Terminal formBALL
Terminal spacing1 mm
terminal coatingtin lead
Terminal locationBOTTOM
Packaging MaterialsPlastic/Epoxy
organize768 CLBS, 500,000 doors
Maximum FCLK clock frequency750 MHz
Number of configurable logic modules768
Programmable logic typeFIELD PROGRAMMABLE GATE array
Number of equivalent gate circuits500000
The maximum delay of a CLB module0.3900 ns
1
R
Virtex-II Platform FPGAs:
Complete Data Sheet
Product Specification
DS031 (v3.5) November 5, 2007
Module 1:
Introduction and Overview
7 pages
Summary of Features
General Description
Architecture
Device/Package Combinations and Maximum I/O
Ordering Examples
Module 3:
DC and Switching Characteristics
43 pages
Electrical Characteristics
Performance Characteristics
Switching Characteristics
Pin-to-Pin Output Parameter Guidelines
Pin-to-Pin Input Parameter Guidelines
DCM Timing Parameters
Source-Synchronous Switching Characteristics
Module 2:
Functional Description
41 pages
Detailed Description
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Input/Output Blocks (IOBs)
Digitally Controlled Impedance (DCI)
Configurable Logic Blocks (CLBs)
18-Kb Block SelectRAM™ Resources
18-Bit x 18-Bit Multipliers
Global Clock Multiplexer Buffers
Digital Clock Manager (DCM)
Module 4:
Pinout Information
226 pages
Pin Definitions
Pinout Tables
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CS144/CSG144 Chip-Scale BGA Package
FG256/FGG256 Fine-Pitch BGA Package
FG456/FGG456 Fine-Pitch BGA Package
FG676/FGG676 Fine-Pitch BGA Package
BG575/BGG575 Standard BGA Package
BG728/BGG728 Standard BGA Package
FF896 Flip-Chip Fine-Pitch BGA Package
FF1152 Flip-Chip Fine-Pitch BGA Package
FF1517 Flip-Chip Fine-Pitch BGA Package
BF957Flip-Chip BGA Package
Routing
Creating a Design
Configuration
IMPORTANT NOTE:
Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
© 2000–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
DS031 (v3.5) November 5, 2007
Product Specification
www.xilinx.com
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