Telephone Circuit, CMOS, CDIP18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDIP-T18 |
| JESD-609 code | e0 |
| Number of terminals | 18 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MV4325DG | MV4325 | |
|---|---|---|
| Description | Telephone Circuit, CMOS, CDIP18 | Telephone Circuit, CMOS, CDIP18, |
| Is it Rohs certified? | incompatible | incompatible |
| package instruction | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown |
| JESD-30 code | R-XDIP-T18 | R-XDIP-T18 |
| JESD-609 code | e0 | e0 |
| Number of terminals | 18 | 18 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP |
| Encapsulate equivalent code | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |