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DS1205S

Description
Memory Circuit, 512X16, CMOS, PDSO16, 0.300 INCH, SOIC-16
Categorystorage    storage   
File Size68KB,6 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric View All

DS1205S Overview

Memory Circuit, 512X16, CMOS, PDSO16, 0.300 INCH, SOIC-16

DS1205S Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
package instruction0.300 INCH, SOIC-16
Reach Compliance Codenot_compliant
JESD-30 codeR-PDSO-G16
JESD-609 codee0
length4.89 mm
memory density8192 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals16
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512X16
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSOP16,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height1.75 mm
Maximum slew rate0.006 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Base Number Matches1
DS1210
Nonvolatile Controller Chip
www.dalsemi.com
FEATURES
Converts CMOS RAMs into nonvolatile
memories
Unconditionally write protects when V
CC
is
out of tolerance
Automatically switches to battery when
power-fail occurs
Space saving 8-pin DIP
Consumes less than 100 nA of battery current
Tests battery condition on power up
Provides for redundant batteries
Optional 5% or 10% power-fail detection
Low forward voltage drop on the V
CC
switch
Optional 16-pin SOIC surface mount package
Optional industrial temperature range of
-40°C to +85°C
PIN ASSIGNMENT
VCCO
VBAT1
TOL
GND
1
2
3
4
8
7
6
5
VCCI
VBAT2
CEO
CE
DS1210 8-pin DIP (300-mil)
See Mech. Drawings Section
NC
VCCO
NC
VBAT1
NC
TOL
NC
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
VCCI
NC
VBAT2
NC
CEO
NC
CE
DS1210S 16-pin SOIC (300-mil)
See Mech. Drawings Section
PIN DESCRIPTION
V
CCO
V
BAT1
TOL
GND
CE
CEO
V
BAT2
V
CCI
NC
- RAM Supply
- + Battery 1
- Power Supply Tolerance
- Ground
- Chip Enable Input
- Chip Enable Output
- + Battery 2
- + Supply
- No Connect
DESCRIPTION
The DS1210 Nonvolatile Controller Chip is a CMOS circuit which solves the application problem of
converting CMOS RAM into nonvolatile memory. Incoming power is monitored for an out-of-tolerance
condition. When such a condition is detected, chip enable is inhibited to accomplish write protection and
the battery is switched on to supply the RAM with uninterrupted power. Special circuitry uses a low-
leakage CMOS process which affords precise voltage detection at extremely low battery consumption.
The 8-pin DIP package keeps PC board real estate requirements to a minimum. By combining the
DS1210 Nonvolatile Controller Chip with a CMOS memory and batteries, nonvolatile RAM operation
can be achieved.
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