HCD6433822R datasheet, PDF - EEWORLD Datasheet

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HCD6433822R: DescriptionMICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，563 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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HCD6433822R Overview

MICROCONTROLLER

HCD6433822R Parametric

Parameter Name	Attribute value
Parts packaging code	DIE
package instruction	DIE,
Contacts	24
Reach Compliance Code	compliant
Has ADC	YES
Address bus width
bit size	8
maximum clock frequency	16 MHz
DMA channel	NO
External data bus width
Number of I/O lines	64
PWM channel	YES
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
speed	8 MHz
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Terminal form	NO LEAD
Terminal location	UPPER
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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REJ09B0144-0300O

The revision list can be viewed directly by

clicking the title page.

The revision list summarizes the locations of

revisions and additions. Details should always

be checked by referring to the relevant text.

H8/3827R

Group

, H8/3827S

Group

Hardware Manual

Renesas 8-Bit Single-Chip Microcomputer

H8 Family/H8/300L Super Low Power Series

Rev.3.00

Revision Date: Mar.12, 2004

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and

more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material

or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corp. product best suited to the customer's application; they do not convey any license

under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp.

or a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-

party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corp. without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or

an authorized Renesas Technology Corp. product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising

from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various

means, including the Renesas Technology Corp. Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data,

diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total

system before making a final decision on the applicability of the information and products. Renesas

Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from

the information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please

contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor

when considering the use of a product contained herein for any specific purposes, such as

apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea

repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must

be exported under a license from the Japanese government and cannot be imported into a country

other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products

contained therein.

HCD6433822R Related Products

	HCD6433822R	HCD6433824R	HCD6433823R	HCD6433827R	HCD6433827S	HCD6433826S	HCD6433825S
Description	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Parts packaging code	DIE	DIE	DIE	DIE	DIE	DIE	DIE
package instruction	DIE,	DIE,	,	DIE,	DIE,	DIE,	DIE,
Contacts	24	24	24	24	80	80	80
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Has ADC	YES	YES	-	YES	YES	YES	YES
bit size	8	8	-	8	8	8	8
maximum clock frequency	16 MHz	16 MHz	-	16 MHz	16 MHz	16 MHz	16 MHz
DMA channel	NO	NO	-	NO	NO	NO	NO
Number of I/O lines	64	64	-	64	64	64	64
PWM channel	YES	YES	-	YES	YES	YES	YES
encapsulated code	DIE	DIE	-	DIE	DIE	DIE	DIE
Package shape	UNSPECIFIED	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP	-	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
speed	8 MHz	8 MHz	-	8 MHz	8 MHz	8 MHz	8 MHz
Maximum supply voltage	5.5 V	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage	3 V	3 V	-	3 V	3 V	3 V	3 V
surface mount	YES	YES	-	YES	YES	YES	YES
Terminal form	NO LEAD	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	-	UPPER	UPPER	UPPER	UPPER
Base Number Matches	1	1	1	1	1	-	-
Maker	-	Renesas Electronics Corporation	Renesas Electronics Corporation	-	-	Renesas Electronics Corporation	Renesas Electronics Corporation

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