Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................-65NC to +150
o
C
Soldering Temperature (reflow) ......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
WLP
Junction-to-Ambient Thermal Resistance (q
JA
) ..........95°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
CC
= 1.6V to 5.5V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
Operating Voltage Range
V
CC
Undervoltage Lockout
V
CC
Supply Current
Supply Current with Oscillator
Running
V
CC
Reset Threshold
V
CC
Reset Threshold Hysteresis
Reset Threshold Tempco
V
CC
to
RESET
Output Delay
Reset Timeout Period
Manual Reset Setup Delay
Debounce Period
t
D
t
RP
t
SU
t
DB
V
CC
falling at 10mV/Fs from (V
TH
+ 100mV)
to (V
TH
- 100mV)
See Table 2
Internal timing (see Tables 1a, 1b, 1c)
-10
-10
18
SYMBOL
V
CC
V
CCUVLO
I
CC
I
CC2
V
TH
V
HYST
V
CC
= 5V, steady-state condition;
MR, MR1,
MR2, RESET,
and
SRESET
not asserted
V
CC
= 3V
V
CC
falling
-2.5%
CONDITIONS
RESET
state guaranteed for V
CC
R
0.95V
MIN
1.6
1.25
8
5
V
TH
2
30
10
t
RP
t
SU
20
+10
+10
22
TYP
MAX
5.5
1.55
10
10
+2.5%
UNITS
V
V
FA
FA
V
%
ppm/
o
C
Fs
%
%
ms
2
MAX16122–MAX16125
Dual Pushbutton Controllers in
Tiny 6-Bump WLP Package
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 1.6V to 5.5V, T
A
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.) (Note 2)
PARAMETER
OUTPUTS (RESET,
SRESET)
V
CC
= V
TH(MIN)
, V
TH
> 4.25V,
I
SINK
= 10mA
V
CC
= V
TH(MIN)
, V
TH
> 2.5V,
I
SINK
= 3.2mA
V
CC
= V
TH(MIN)
, V
TH
> 1.67V,
I
SINK
= 1mA
V
CC
= V
TH(MIN)
, V
TH
> 1V, I
SINK
= 100FA
V
CC
> 0.95V, V
CC
falling, I
SINK
= 15FA
V
CC
> 0.95V, I
SOURCE
= 15FA
V
CC
> 1.2V, I
SOURCE
= 100FA
RESET, SRESET
Output High
(Push-Pull Outputs)
V
OH
V
CC
> 1.67V, I
SOURCE
= 150FA
V
CC
> 2.7V, I
SOURCE
= 500FA
V
CC
> 4.5V, I
SOURCE
= 800FA
RESET, SRESET
Output Leakage
Current (Open-Drain Outputs)
MANUAL RESET INPUTS (MR,
MR1, MR2)
MR1, MR2, MR
Input Voltage Low
MR1, MR2, MR
Input Voltage High
Manual Reset Minimum Pulse
Width
Manual Reset Glitch Rejection
Manual Reset to Soft Reset Delay
MR1, MR2, MR
Internal Pullup
Resistance
SELECT (SEL) LOGIC INPUT
SEL Input Low Voltage
SEL Input High Voltage
SEL Input Leakage
0.85 x
V
CC
-8
+8
0.15 x
V
CC
V
V
µA
t
MRD
25
V
IL
V
IH
0.7 x V
CC
1
100
200
50
80
0.3 x V
CC
V
V
Fs
ns
ns
kI
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
0.8 x
V
CC
1
0.4
0.4
0.4
0.4
0.4
V
V
V
V
V
V
V
V
V
V
FA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
RESET, SRESET
Output Low
V
OL
Note 2:
All parameters are production tested at T
A
= +25NC. Limits over the operating temperature range are guaranteed by
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