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AS413RAA272JSC

Description
General Purpose Inductor, 2.7uH, 5%, 1 Element, Ceramic-Core, SMD, 1111, CHIP, 1008
CategoryPassive components    inductor   
File Size80KB,2 Pages
ManufacturerCOILCRAFT
Websitehttp://www.coilcraft.com/
Download Datasheet Parametric View All

AS413RAA272JSC Overview

General Purpose Inductor, 2.7uH, 5%, 1 Element, Ceramic-Core, SMD, 1111, CHIP, 1008

AS413RAA272JSC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
package instructionCHIP, 1008
Reach Compliance Codecompliant
ECCN codeEAR99
uppercase and lowercase codes1111
structureChip
core materialCERAMIC
DC Resistance3.2 Ω
Nominal inductance(L)2.7 µH
Inductor ApplicationsRF INDUCTOR
Inductor typeGENERAL PURPOSE INDUCTOR
JESD-609 codee0
Manufacturer's serial numberAS413RAA
Number of functions1
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height2.03 mm
Package length2.92 mm
Package formSMT
Package width2.79 mm
method of packingTR, Plastic, 7 Inch
Minimum quality factor (at nominal inductance)20
Maximum rated current0.29 A
self resonant frequency110 MHz
seriesAS413RAA
Shape/Size DescriptionRECTANGULAR PACKAGE
shieldNO
surface mountYES
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal locationDUAL ENDED
Terminal shapeWRAPAROUND
Test frequency7.9 MHz
Tolerance5%
Base Number Matches1
1008 CHIP INDUCTORS
Outgassing Compliant Chip Inductors
AS413RAA
High SRF and excellent Q values
Tight tolerances, many values at 1%
39 inductance values from 10 nH to 8.2 µH
Current Derating
120
110
100
Percent of rated
I
rms
This robust version of Coilcraft’s standard 1008CS series
features high temperature materials that pass NASA low
outgassing specifications and allow operation in ambient
temperatures up to 155°C. The leach-resistant base
metalization with tin-lead (Sn-Pb) terminations ensures
the best possible board adhesion.
90
80
70
60
50
25°C
Typical Q vs Frequency
120
100
100
90
80
100 nH
12 nH
40
30
20
10
0
47 nH
-40
-20
0
20
40
60
80
100
120
140 160
Ambient temperature (°C)
Q Factor
70
60
50
40
30
20
10
0
10
100
1000
10000
E
terminal
330 nH
750 nH
1800 nH
A
B
overall
F
G
F
C
I
J
I
D
Terminal wraparound:
approx 0.015/0,38 both ends
H
Frequency (MHz)
Suggested
Land Pattern
G
H
I
J
0.060 0.100 0.040 0.050
1,52 2,54 1,02 1,27
Typical L vs Frequency
1,000
900
800
750 nH
A max B max
0.115 0.110
2,92
2,79
C max D ref
0.080 0.020
2,03
0,51
E
F
0.080 0.020
2,03 0,51
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to
B
and
0.006 in / 0,15 mm to
A
and
C.
Inductance (nH)
700
600
500
400
300
200
100
0
1
10
100
1000
100 nH
47 nH
12 nH
10000
330 nH
Frequency (MHz)
Core material
Ceramic
Terminations
Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature
–55°C to +125°C with
Imax
current, +125°C
to +155°C with derated current
Storage temperature
Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat
Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)
+25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)
1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging
2000 per 7″ reel
Plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing,
2.0 mm pocket depth
®
Specifications subject to change without notice.
Please check our website for latest information.
Document AS101-1 Revised 12/17/10
1102 Silver Lake Road
Cary IL 60013
© Coilcraft, Inc. 2011
Phone 800-981-0363
Fax 847-639-1508
E-mail cps@coilcraft.com
Web www.coilcraft-cps.com
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