Wire Bondable
Resistor Network Arrays
Chip Network Array Series
•
Absolute tolerances to ±0.1%
•
Tight TCR tracking to ±5ppm/°C
•
Ratio match tolerances to ±0.05%
•
Ultra-stable tantalum nitride resistors
IRC’s TaNSil
®
network array resistors are ideally suited for applications
that demand a small footprint. The small wire bondable chip package
provides higher component density, lower resistor cost and high reliability.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost.
Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil
®
resistor film.
For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC
network array die.
Electrical Data
Isolated
Resistance Range
Absolute Tolerance
Ratio Tolerance to R1
Absolute TCR
Tracking TCR
Element Power Rating
Package Power Rating
Rated Operating Voltage
(not to exceed
√
P x R)
Operating Temperature
Noise
Substrate Material
Substrate Thickness
Bond Pad
Metallization
Backside
Passivation
General Note
TCR/Inspection Code Table
Bussed
10Ω to 1.25MΩ
±300ppm/°C
to ±0.1%
±100ppm/°C
±50ppm/°C
±25ppm/°C
Absolute TCR
10Ω to 2.5MΩ
Commercial
Code
00
01
02
03
MIL Inspection
Code*
04
05
06
07
to ±0.1%
to ±0.05%
to ±25ppm/°C
to ±5ppm/°C
100mW @ 70°C
50mW @ 70°C
8-Pad 400mW @ 70°C
16-Pad 800mW @ 70°C
24-Pad 1.0W @ 70°C
100V
-55°C to +150°C
<-30dB
Oxidized Silicon (10KÅ SiO
2
minimum)
0.016˝ ±0.001
(0.406mm ±0.01)
10KÅ minimum
15KÅ minimum
Silicon
(gold available)
Silicon Dioxide or Silicon Nitride
*Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection
Power Derating Data
Aluminum
Gold
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 4
Wire Bondable
Resistor Network Arrays
Manufacturing Capabilities Data
Isolated schematic A
Bussed schematic B
Absolute
TCR
(±ppm/°C)
Ohmic
range
(Ω)
10 - 25
26 - 50
51 - 200
Available
tolerances
Available
ratio
tolerances
FG
CDF
CDFG
ABCDFG
Best TCR
tracking
(±ppm/°C)
50
10
5
5
Ohmic
range
(Ω)
10 - 25
26 - 50
51 - 100
101 - 200
201 - 500
Available
tolerances
Available
ratio
tolerances
FG
DFG
CDFG
BCDFG
BCDFG
Best TCR
tracking
(±ppm/°C)
200
100
50
25
20
5
100
50
25
20
5
50
25
20
5
20
5
FGJ
DFGJ
CDFGJ
BCDFGJ
FGJ
FGJ
DFGJ
DFGJ
BCDFGJ
300
201 - 2.5M
501 - 1.25M B C D F G J A B C D F G
26 - 50
51 - 200
100
201 - 2.5M
DFGJ
CDFGJ
BCDFGJ
CDFG
CDFG
ABFG
10
5
5
26 - 50
51 - 100
101 - 200
201 - 500
501 - 350K
26 - 50
51 - 200
50
201 - 2.5M
BCDFGJ
ABFG
5
201 - 500
BCDFGJ
BCDFG
DFGJ
CDFGJ
CDFG
CDFG
10
5
51 - 100
101 - 200
FGJ
DFGJ
DFGJ
BCDFGJ
DFG
CDFG
BCDFG
BCDFG
BCDFGJ ABCDFG
DFGJ
DFGJ
CDFG
BCDFG
501 - 1.25M B C D F G J A B C D F G
51 - 200
25
201 - 2.5M
BCDFGJ
ABFG
5
501 - 1.25M B C D F G J A B C D F G
CDFGJ
CDFG
5
201 - 500
BCDFGJ
BCDFG
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 2 of 4
Wire Bondable
Resistor Network Arrays
Physical Data
DSS4X
8
DSS4A
7
6
5
0.070˝ ±0.001
(1.778mm ±0.025)
R1
0.070˝ ±0.001
(1.778mm ±0.025)
1
2
3
4
Pad 1
8
DSS4B
7
6
5
0.004˝ min Bond Pads
R1
1
2
3
4
DSS8X
DSS8A
16
15
14
13
12
11
10
9
0.140˝ ±0.001
(3.556mm ±0.025)
0.080˝ ±0.001
(2.032mm ±0.025)
R1
1
2
3
4
5
6
7
8
Pad 1
16
15
14
DSS8B
13
12
11
10
9
0.004˝ min Bond Pads
R1
1
2
3
4
5
6
7
8
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 3 of 4
Wire Bondable
Resistor Network Arrays
Physical Data
DQSCX
0.115˝ ±0.001
(2.921mm ±0.025)
24
23
22
21
20
DQSCA
19
18
17
16
15
14
13
R1
0.086˝ ±0.001
(2.184mm ±0.025)
1
2
3
4
5
6
7
8
9
10
11
12
DQSCB
24
23
22
21
20
19
18
17
16
15
14
13
Pad 1
R1
0.004˝ min Bond Pads
1
2
3
4
5
6
7
8
9
10
11
12
Environmental Data
Test
Method
MIL-STD-202
Method 107
Test condition F
MIL-STD-883
Method 1008
150°C, 1000 hours
-55°C, 1000 hours
MIL-STD-202
Method 108
70°C, 1000 hours
MIL-STD-202
Method 108
125°C, 1000 hours
Max
∆R
Typical
∆R
Ordering Data
Prefix
Style
DSS4 = 8-pad Network
DSS8 = 6-pad Network
DQSC = 24-pad Network
WBD
DSS8 - B - 01 - 1002 - F - B
Thermal Shock
±0.1%
±0.02%
Schematic and Termination
A = Isolated; B = Bussed
TCR/Inspection Code
Reference TCR/Inspection Code Table
High Temperature
Exposure
Low Temperature
Storage
±0.1%
±0.05%
Resistance Code
4-Digit Resistance Code
Ex: 1002 = 10KΩ, 50R1 = 50.1Ω
±0.03%
±0.01%
Absolute Tolerance Code
J = ±5%; G = ±2%; F = ±1%;
D = ±0.5%; C = ±0.25%; B = ±0.1%
G = ±2%; F = ±1%; D = ±0.5%;
C = ±0.25%; B = ±0.1%; A = 0.05%
Ratio Tolerance Code (optional)
Life
Life at Elevated
Temperature
±0.5%
±0.01%
Packaging
±0.5%
±0.05%
Standard packaging is 2˝ x 2˝ chip tray. For additional information
or to discuss your specific requirements, please contact our Applications
Team using the contact details below.
© IRC Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 4 of 4
DSP and ARM Processors
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