PSD813F3R datasheet, PDF - EEWORLD Datasheet

PSD813F3R: DescriptionParallel I/O Port, 27 I/O, CMOS, PQCC52, PLASTIC, LDCC-52; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，84 Pages; ManufacturerWaferscale Integration Inc.

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PSD813F3R Overview

Parallel I/O Port, 27 I/O, CMOS, PQCC52, PLASTIC, LDCC-52

Parameter Name	Attribute value
package instruction	PLASTIC, LDCC-52
Reach Compliance Code	unknown
JESD-30 code	S-PQCC-J52
Number of I/O lines	27
Number of ports	4
Number of terminals	52
Package body material	PLASTIC/EPOXY
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Terminal form	J BEND
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches	1

	PSD813F3R	PSD813F2	PSD813F3	PSD813F1
Description	Parallel I/O Port, 27 I/O, CMOS, PQCC52, PLASTIC, LDCC-52	Parallel I/O Port, 27 I/O, CMOS, PQCC52, PLASTIC, LDCC-52	Parallel I/O Port, 27 I/O, CMOS, PQCC52, PLASTIC, LDCC-52	Parallel I/O Port, 27 I/O, CMOS, PQCC52, PLASTIC, LDCC-52
package instruction	PLASTIC, LDCC-52	PLASTIC, LDCC-52	PLASTIC, LDCC-52	PLASTIC, LDCC-52
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52	S-PQCC-J52
Number of I/O lines	27	27	27	27
Number of ports	4	4	4	4
Number of terminals	52	52	52	52
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Terminal form	J BEND	J BEND	J BEND	J BEND
Terminal location	QUAD	QUAD	QUAD	QUAD
uPs/uCs/peripheral integrated circuit type	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE

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