W25X40ALSSIZ datasheet, PDF - EEWORLD Datasheet

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W25X40ALSSIZ: Description1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI; File Size1MB，45 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W25X40ALSSIZ Overview

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

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W25X10AL, W25X20AL, W25X40AL, W25X80AL

1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT

2.5V SERIAL FLASH MEMORY WITH

4KB SECTORS AND DUAL OUTPUT SPI

-1-

Publication Release Date: May 9, 2008

Revision B

W25X10AL, W25X20AL, W25X40AL, W25X80AL

Table of Contents

GENERAL DESCRIPTION ......................................................................................................... 4

FEATURES ................................................................................................................................. 4

PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5

PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5

PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6

PIN DESCRIPTION..................................................................................................................... 6

7.1

7.2

7.3

7.4

7.5

7.6

7.7

Package Types ............................................................................................................... 7

Chip Select (/CS) ............................................................................................................ 7

Serial Data Output (DO) ................................................................................................. 7

Write Protect (/WP)......................................................................................................... 7

HOLD (/HOLD) ............................................................................................................... 7

Serial Clock (CLK) .......................................................................................................... 7

Serial Data Input / Output (DIO) ..................................................................................... 7

BLOCK DIAGRAM ...................................................................................................................... 8

FUNCTIONAL DESCRIPTION ................................................................................................... 9

9.1

SPI OPERATIONS ......................................................................................................... 9

9.1.1

9.1.2

9.1.3

SPI Modes........................................................................................................................9

Dual Output SPI................................................................................................................9

Hold Function ...................................................................................................................9

Write Protect Features....................................................................................................10

9.2

10.

WRITE PROTECTION.................................................................................................. 10

9.2.1

CONTROL AND STATUS REGISTERS................................................................................... 11

10.1

STATUS REGISTER .................................................................................................... 11

10.1.1

10.1.2

10.1.3

10.1.4

10.1.5

10.1.6

10.1.7

BUSY............................................................................................................................11

Write Enable Latch (WEL) ............................................................................................11

Block Protect Bits (BP2, BP1, BP0)..............................................................................11

Top/Bottom Block Protect (TB).....................................................................................11

Reserved Bits ...............................................................................................................11

Status Register Protect (SRP) ......................................................................................12

Status Register Memory Protection ..............................................................................13

Manufacturer and Device Identification.........................................................................14

Instruction Set...............................................................................................................15

Write Enable (06h)........................................................................................................16

Write Disable (04h).......................................................................................................16

Read Status Register (05h) ..........................................................................................17

10.2

INSTRUCTIONS........................................................................................................... 14

10.2.1

10.2.2

10.2.3

10.2.4

10.2.5

-2-

W25X10AL, W25X20AL, W25X40AL, W25X80AL

10.2.6

10.2.7

10.2.8

10.2.9

10.2.10

10.2.11

10.2.12

10.2.13

10.2.14

10.2.15

10.2.16

10.2.17

Write Status Register (01h) ..........................................................................................18

Read Data (03h) ...........................................................................................................19

Fast Read (0Bh) ...........................................................................................................20

Fast Read Dual Output (3Bh) .......................................................................................21

Page Program (02h) ...................................................................................................22

Sector Erase (20h) .....................................................................................................23

Block Erase (D8h) ......................................................................................................24

Chip Erase (C7h)........................................................................................................25

Power-down (B9h) ......................................................................................................26

Release Power-down / Device ID (ABh) .....................................................................27

Read Manufacturer / Device ID (90h) .........................................................................29

JEDEC ID (9Fh)..........................................................................................................30

11.

ELECTRICAL CHARACTERISTICS......................................................................................... 31

11.1

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

11.10

11.11

Absolute Maximum Ratings .......................................................................................... 31

Operating Ranges......................................................................................................... 31

Endurance and Data Retention .................................................................................... 32

Power-up Timing and Write Inhibit Threshold .............................................................. 32

DC Electrical Characteristics ........................................................................................ 33

AC Measurement Conditions........................................................................................ 34

AC Electrical Characteristics ........................................................................................ 35

AC Electrical Characteristics (cont’d) ........................................................................... 36

Serial Output Timing ..................................................................................................... 37

Input Timing................................................................................................................. 37

Hold Timing ................................................................................................................. 37

8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38

8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39

8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40

8-Pad WSON 6x5mm (Package Code ZP) .................................................................. 41

8-Pad WSON 6x5mm Cont’d........................................................................................ 42

12.

PACKAGE SPECIFICATION .................................................................................................... 38

12.1

12.2

12.3

12.4

12.5

13.

14.

ORDERING INFORMATION .................................................................................................... 43

REVISION HISTORY ................................................................................................................ 45

-3-

Publication Release Date: May 9, 2008

Revision B

W25X10AL, W25X20AL, W25X40AL, W25X80AL

1. GENERAL DESCRIPTION

The W25X10AL (1M-bit), W25X20AL (2M-bit), W25X40AL (4M-bit) and W25X80AL (8M-bit) Serial

Flash memories provide a storage solution for systems with limited space, pins and power. The 25X

series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for

code download applications as well as storing voice, text and data. The devices operate on a single

2.3V to 3.6V power supply with current consumption as low as 5mA active and 1µA for power-down.

All devices are offered in space-saving packages.

The W25X10AL/20AL/40AL/80AL array is organized into 512/1024/2048/4096 programmable pages

of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction.

Pages can be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip

(chip erase). The W25X10AL/20AL/40AL/80AL has 32/64/128/256 erasable sectors and 2/4/8/16

erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that

require data and parameter storage. (See figure 2.)

The W25X10AL/20AL/40AL/80AL supports the standard Serial Peripheral Interface (SPI), and a high

performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial

Data Out. SPI clock frequencies of up to 50MHz are supported allowing equivalent clock rates of

100MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to

those of 8 and 16-bit Parallel Flash memories.

A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control

features, provide further control flexibility. Additionally, the device supports JEDEC standard

manufacturer and device identification.

2. FEATURES

•

Family of Serial Flash Memories

– W25X10AL: 1M-bit / 128K-byte (131,072)

– W25X20AL: 2M-bit / 256K-byte (262,144)

– W25X40AL: 4M-bit / 512K-byte (524,288)

– W25X80AL: 8M-bit / 1M-byte (1,048,576)

– 256-bytes per programmable page

– Uniform 4K-byte Sectors / 64K-byte Blocks

•

SPI with Single or Dual Outputs

– Clock, Chip Select, Data I/O, Data Out

– Optional Hold function for SPI flexibility

•

Data Transfer up to 100M-bits / second

– Clock operation to 50MHz

– Fast Read Dual Output instruction

– Auto-increment Read capability

•

Flexible Architecture with 4KB sectors

– Sector Erase (4K-bytes)

– Block Erase (64K-byte)

– Page program up to 256 bytes <2ms

– Minimum 100,000 erase/write cycles

– 20-year retention

•

Low Power Consumption, Wide

Temperature Range

– Single 2.3 to 3.6V supply

– 5mA active current, 1µA Power-down (typ)

– -40° to +85°C operating range

•

Software and Hardware Write Protection

– Write-Protect all or portion of memory

– Enable/Disable protection with /WP pin

– Top or bottom array protection

•

Space Efficient Packaging

– 8-pin SOIC 150-mil

– 8-pin SOIC 208-mil (W25X40AL/80AL)

– 8-pin PDIP 300-mil

– 8-pad WSON 6x5-mm

-4-

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