HIGH VOLTAGE CHIP CAPACITORS
1. PART NO. EXPRESSION :
V3X SERIES
V3X471J-B-10
(a) (b) (c) (d) (e)
(f)
(a) Chip Size
(b) Temp. Coefficient : X ( ±15% )
( Temp. range : -55°C to +125°C )
(c) Capacitance code : 471 = 470pF
(d) Tolerance code
(e) Voltage code : B = 200Vdc
(f) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
D
L
G
B
C
PCB Pattern
Unit:m/m
A
B
C
D
G
H
L
2.00±0.20 1.25±0.20 1.45 Max.
0.20 Min. 0.70 - 0.90 0.80 - 1.10 0.60 - 0.80
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ceramic
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Storage temp. : +5°C to +40°C
b) Operating temp. : -55°C to +125°C
c) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH VOLTAGE CHIP CAPACITORS
7. RELIABILITY & TEST CONDITION :
V3X SERIES
ITEM
Electrical Characteristics Test
Visual
Insulation
Resistance
PERFORMANCE
TEST CONDITION
No abnormal exterior appearance
10,000M or 500/C
product whichever is smaller
Visual inspection
V < 500V, Rated Voltage
V > 500V, Applied 500Vdc
Charge Time: 60sec
is applied less than 50mA current
Capacitance
Within the specified tolerance
[Class I (N) & Class II]
Class I :
C < 100pF : Freq. = 1MHz±10%, Voltage = 1.0±0.2Vrms
C > 100pF : Freq. = 1KHz±10%
Class II :
X : Freq. = 1KHz±10%, Voltage = 1.0±0.2Vrms
Z/E : Freq. = 1KHz±10%, Voltage = 1.0±0.2Vrms
Perform a heat temp. at 150±5°C for 30min. then place
room temp. for 24±2hr
Q
Class I (N) :
More than 30pF : Q > 1000
30pF & below : Q > 400+20C
(C: Capacitance, pF)
Tan
Withstanding Voltage
Class II (X) : 2.5% maximum
Class II (Z/E) : 4.0% maximum
No dielectric breakdown or mechanical
breakdown
200V < V < 500V : 200% rated voltage
500V < V < 1000V : 150% rated voltage
1000 < V : 120% rated voltage
for 1-5sec. Current is limited to less than 50mA.
* Withstanding voltage testing requires immersion of the element in a isolation fluid prevent
arching on the chip surface, at voltage over 1000Vdc.
Temperature Capacitance
Coefficient
Class I :
Char.
N
Class II :
Char.
X
E
Z
Temp. Range
-55°C ~ +125°C
-30°C ~ +85°C
+10°C ~ +85°C
Cap. Change (%)
±15%
+22% ~ -56%
+22% ~ -56%
Temp. Range
-55°C ~ +125°C
Cap. Change (%)
±30ppm/°C
Class I :
[C2-C1/C1(T2-T1)] x 100%
Class II :
(C2-C1)/C1 x 100%
T1 : Standard temperature (25°C)
T2 : Test temperature
C1 : Capacitance at standard temperature (25°C)
C2 : Capacitance at test temperature (T2)
Adhesive Strength
of Termination
No indication of peeling shall occur on the
terminal electrode
A 5N f pull force shall be applied for 10±1second
5N f
Resistance to Flexure
of Substrate
Appearance :
No mechanical damage shall be occur
C-Meter : Capacitance Change
Bending shall be applied to the 1.0mm with 1.0mm/sec
R230
C Meter
45±1mm
45±1mm
NOTE : Specifications subject to change without notice. Please check our website for latest information.
Bending
Limit
N : < ±5.0%
X : < ±12.5%
E/Z : < ±30.0%
15.01.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
Domestic Chip Exchange
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