White Electronic Designs
1GB – 2x64Mx72 DDR SDRAM UNBUFFERED
FEATURES
Double-data rate architecture
DDR200, DDR266, DDR333 and DDR400
• JEDEC design specifications
BI-directional data strobes (DQS)
Differential clock inputs (CK & CK#)
Programmable Read Latency 2,2.5 (clock)
Programmable Burst Length (2,4,8)
Programmable Burst type (sequential & interleave)
Edge aligned data output, center aligned data input.
Auto and self refresh
Serial presence detect
Dual Rank
Power supply:
• V
CC
= V
CCQ
= +2.5V ± 0.20V (100, 133, 166MHz)
• V
CC
= V
CCQ
= +2.6V ± 0.10V (200MHz)
JEDEC Standard 184 pin DIMM package
• PCB height: 30.48 (1.20")
NOTE: Consult factory for availability of:
• RoHS compliant products
• Vendor source control options
• Industrial temperature option
W3EG72128S-D3
-JD3
ADVANCED*
DESCRIPTION
the W3EG72128S is a 2x64Mx72 Double data Rate
SDRAM memory module based on 512Mb DDR SDRAM
components. The module consists of eighteen 64Mx8 DDR
SDRAMs in 66 pin TSOP packages mounted on a 184 pin
FR4 substrate. This module is structured as 2 Ranks of
128Mx72 DDR SDRAM.
Synchronous design allows precisse cycle control with the
use of system clock. Data I/O transactions are possible on
both edges and Burst Lengths allow the same device to be
useful for a variety of high bandwidth, high performance
memory system applications.
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
OPERATING FREQUENCIES
DDR400 @CL=3
Clock Speed
CL-t
RCD
-t
RP
200MHz
3-3-3
DDR333 @CL=2.5
166MHz
2.5-3-3
DDR266 @CL=2
133MHz
2-2-2
DDR266 @CL=2.5
133MHz
2.5-3-3
DDR200 @CL=2
100MHz
2-2-2
May 2005
Rev. 3
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
PIN CONFIGURATION
PIN# SYMBOL PIN# SYMBOL PIN# SYMBOL PIN# SYMBOL
1
V
REF
47
DQS8
93
V
SS
139
V
SS
2
DQ0
48
A0
94
DQ4
140
DQM8
3
V
SS
49
CB2
95
DQ5
141
A10
96
V
CCQ
142
CB6
4
DQ1
50
V
SS
5
DQS0
51
CB3
97
DQM0
143
V
CCQ
6
DQ2
52
BA1
98
DQ6
144
CB7
7
V
CC
53
DQ32
99
DQ7
145
V
SS
8
DQ3
54
V
CCQ
100
V
SS
146
DQ36
9
NC
55
DQ33
101
NC
147
DQ37
10
NC
56
DQS4
102
NC
148
V
CC
11
V
SS
57
DQ34
103
NC
149
DQM4
12
DQ8
58
V
SS
104
V
CCQ
150
DQ38
13
DQ9
59
BA0
105
DQ12
151
DQ39
14
DQS1
60
DQ35
106
DQ13
152
V
SS
15
V
CCQ
61
DQ40
107
DQM1
153
DQ44
16
CK1
62
V
CCQ
108
V
CC
154
RAS#
17
CK1#
63
WE#
109
DQ14
155
DQ45
18
V
SS
64
DQ41
110
DQ15
156
V
CCQ
19
DQ10
65
CAS#
111
CKE1
157
CS0#
20
DQ11
66
V
SS
112
V
CCQ
158
CS1#
21
CKE0
67
DQS5
113
NC
159
DQM5
22
V
CCQ
68
DQ42
114
DQ20
160
V
SS
23
DQ16
69
DQ43
115
A12
161
DQ46
116
V
SS
162
DQ47
24
DQ17
70
V
CC
25
DQS2
71
NC
117
DQ21
163
NC
26
V
SS
72
DQ48
118
A11
164
V
CCQ
27
A9
73
DQ49
119
DQM2
165
DQ52
120
V
CC
166
DQ53
28
DQ18
74
V
SS
29
A7
75
CK2#
121
DQ22
167
NC
30
VCCQ
76
CK2
122
A8
168
V
CC
31
DQ19
77
V
CCQ
123
DQ23
169
DQM6
32
A5
78
DQS6
124
V
SS
170
DQ54
33
DQ24
79
DQ50
125
A6
171
DQ55
34
V
SS
80
DQ51
126
DQ28
172
V
CCQ
35
DQ25
81
V
SS
127
DQ29
173
NC
36
DQS3
82
V
CCID
128
V
CCQ
174
DQ60
37
A4
83
DQ56
129
DQM3
175
DQ61
38
V
CC
84
DQ57
130
A3
176
V
SS
39
DQ26
85
V
CC
131
DQ30
177
DQM7
40
DQ27
86
DQS7
132
V
SS
178
DQ62
41
A2
87
DQ58
133
DQ31
179
DQ63
42
V
SS
88
DQ59
134
CB4
180
V
CCQ
43
A1
89
V
SS
135
CB5
181
SA0
44
CB0
90
NC
136
V
CCQ
182
SA1
45
CB1
91
SDA
137
CK0
183
SA2
46
V
CC
92
SCL
138
CK0#
184 V
CCSPD
A0-A12
BA0-BA1
DQ0-DQ63
CB0-CB7
DQS0-DQS7
CK0, CK1, CK2
CK0#, CK1#, CK2#
CKE0, CKE1
CS0#, CS1#
RAS#
CAS#
WE#
DQM0-DQM7
V
CC
V
CCQ
V
SS
V
REF
V
CCSPD
SDA
SCL
SA0-SA2
V
CCID
NC
W3EG72128S-D3
-JD3
ADVANCED
PIN NAMES
Address Input (Multiplexed)
Bank Select Address
Data Input/Output
Check bits
Data Strobe Input/Output
Clock Input
Clock Input
Clock Enable input
Chip Select Input
Row Address Strobe
Column Address Strobe
Write Enable
Data-In Mask
Power Supply
Power Supply for DQS
Ground
Power Supply for Reference
Serial EEPROM Power Supply
Serial data I/O
Serial clock
Address in EEPROM
V
CC
Indentification Flag
No Connect
May 2005
Rev. 3
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
FUNCTIONAL BLOCK DIAGRAM
CS1#
CS0#
DQS0
DQM0
DQS4
DQM4
W3EG72128S-D3
-JD3
ADVANCED
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQS1
DQM1
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQS5
DQM5
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQS2
DQM2
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQS6
DQM6
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQS3
DQM3
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQS7
DQM7
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQS8
DQM8
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
DM
I/O 7
I/O 6
I/O 1
I/O 0
I/O 5
I/O 4
I/O 3
I/O 2
CS#
DQS
DM
I/O 0
I/O 1
I/O 6
I/O 7
I/O 2
I/O 3
I/O 4
I/O 5
CS#
DQS
Serial PD
SCL
WP
A0
SA0
A1
SA1
A2
SA2
SDA
BA0-BA1
A0-A12
RAS#
CAS#
CKE1
CKE0
WE#
BA0-BA1: DDR SDRAMs
Clock Input
SDRAMs
6 SDRAMs
6 SDRAMs
6 SDRAMs
A0-A12: DDR SDRAMs
CK0/CK0#
RAS#: DDR SDRAMs
CAS#: DDR SDRAMs
CKE: DDR SDRAMs
CKE: DDR SDRAMs
W E # : DDR SDRAMs
CK1/CK1#
CK2/CK2#
V
CCSPD
V
CC
/ V
CCQ
SPD
DDR SDRAM
V
REF
DDR SDRAM
DDR SDRAM
V
SS
NOTE: All resistor values are 22 ohms unless otherwise specified
May 2005
Rev. 3
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to V
SS
Voltage on V
CC
supply relative to V
SS
Storage Temperature
Power Dissipation
Short Circuit Current
Note:
W3EG72128S-D3
-JD3
ADVANCED
Symbol
V
IN
, V
OUT
V
CC
, V
CCQ
T
STG
P
D
I
OS
Value
-0.5 to 3.6
-1.0 to 3.6
-55 to +150
18
50
Units
V
V
°C
W
mA
Permanent device damage may occur if ‘ABSOLUTE MAXIMUM RATINGS’ are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability
DC CHARACTERISTICS
0°C
≤
T
A
≤
70°C, V
CC
= 2.5V ± 0.2V
Symbol
V
CC
V
CCQ
V
REF
V
TT
V
IH
V
IL
V
OH
V
OL
Parameter
Supply Voltage
Supply Voltage
Reference Voltage
Termination Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Min
2.3
2.3
1.15
1.15
V
REF
+ 0.15
-0.3
V
TT
+ 0.76
—
Max
2.7
2.7
1.35
1.35
V
CCQ
+ 0.3
V
REF
-0.15
—
V
TT
-0.76
Unit
V
V
V
V
V
V
V
V
CAPACITANCE
T
A
= 25°C. f = 1MHz, V
CC
= 2.5V ± 0.2V
Parameter
Input Capacitance (A0-A12)
Input Capacitance (RAS#,CAS#,WE#)
Input Capacitance (CKE0, CKE1)
Input Capacitance (CK0#, CK0)
Input Capacitance (CS0#, CS1#)
Input Capacitance (DQM0-DQM8)
Input Capacitance (BA0-BA1)
Data input/output capacitance (DQ0-DQ63)(DQS)
Data input/output capacitance (CB0-CB7)
Symbol
C
IN1
C
IN2
C
IN3
C
IN4
C
IN5
C
IN6
C
IN7
C
OUT
C
OUT
Max
59
59
32
59
32
13
59
13
13
Unit
pF
pF
pF
pF
pF
pF
pF
pF
pF
May 2005
Rev. 3
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
I
DD
SPECIFICATIONS AND TEST CONDITIONS
V
CCQ
= 2.5V ± 0.2V, V
CC
= 2.5V ± 0.2V; DDR400: V
CC
= V
CCQ
= 2.6V ± 0.1V
Includes DDR SDRAM component only
DDR400@
CL=3
Max
DDR333@
CL=2.5
Max
DDR266@
CL=2
Max
W3EG72128S-D3
-JD3
ADVANCED
Parameter
Operating Current
Symbol Conditions
I
DD0
One device bank; Active - Precharge;
t
RC
=t
RC
(MIN); t
CK
=t
CK
(MIN); DQ,DM
and DQS inputs changing once per
clock cycle; Address and control
inputs changing once every two
cycles.
One device bank; Active-Read-
Precharge Burst = 2; t
RC
=t
RC
(MIN);
t
CK
=t
CK
(MIN); l
OUT
= 0mA; Address
and control inputs changing once per
clock cycle.
All device banks idle; Power-down
mode; t
CK
=t
CK
(MIN); CKE=(low)
CS# = High; All device banks idle;
t
CK
=t
CK
(MIN); CKE = high; Address
and other control inputs changing
once per clock cycle. V
IN
= V
REF
for
DQ, DQS and DM.
One device bank active; Power-
Down mode; t
CK
(MIN); CKE=(low)
CS# = High; CKE = High; One device
bank; Active-Precharge; t
RC
=t
RAS
(MAX); t
CK
=t
CK
(MIN); DQ, DM and
DQS inputs changing twice per clock
cycle; Address and other control
inputs changing once per clock cycle.
Burst = 2; Reads; Continuous burst;
One device bank active; Address
and control inputs changing once
per clock cycle; T
CK
= T
CK
(MIN); l
OUT
= 0mA.
Burst = 2; Writes; Continuous burst;
One device bank active; Address
and control inputs changing once per
clock cycle; t
CK
=t
CK
(MIN); DQ,DM
and DQS inputs changing once per
clock cycle.
t
RC
= t
RC
(MIN)
CKE
≤
0.2V
Four bank interleaving Reads (BL=4)
with auto precharge with t
RC
=t
RC
(MIN); t
CK
=t
CK
(MIN); Address and
control inputs change only during
Active Read or Write commands.
DDR266@
CL=2.5
Max
DDR200@
CL=2
Max
Units
mA
2475
2070
2070
2070
2070
Operating Current
I
DD1
mA
2745
2340
2340
2340
2340
Precharge Power-
Down Standby Current
Idle Standby Current
I
DD2P
I
DD2F
90
90
90
90
90
rnA
mA
990
810
810
810
810
Active Power-Down
Standby Current
Active Standby Current
I
DD3P
I
DD3N
810
630
630
630
630
mA
mA
1080
900
900
900
900
Operating Current
I
DD4R
mA
2790
2385
2385
2385
2385
Operating Current
I
DD4W
rnA
2835
2475
2475
2475
2475
Auto Refresh Current
Self Refresh Current
Operating Current
I
DD5
I
DD6
I
DD7A
4185
90
3510
90
3510
90
3510
90
3510
90
mA
mA
mA
5130
4545
4500
4500
4500
May 2005
Rev. 3
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
Embedded System
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